Vulnerabilities > Qualcomm > Snapdragon 675 Mobile Platform Firmware > High
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2024-02-06 | CVE-2023-33076 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in Core when updating rollback version for TA and OTA feature is enabled. | 7.8 |
| 2024-02-06 | CVE-2023-43513 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption while processing the event ring, the context read pointer is untrusted to HLOS and when it is passed with arbitrary values, may point to address in the middle of ring element. | 7.8 |
| 2024-02-06 | CVE-2023-43522 | NULL Pointer Dereference vulnerability in Qualcomm products Transient DOS while key unwrapping process, when the given encrypted key is empty or NULL. | 7.5 |
| 2024-02-06 | CVE-2023-43533 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS in WLAN Firmware when the length of received beacon is less than length of ieee802.11 beacon frame. | 7.5 |
| 2024-02-06 | CVE-2023-43536 | Unspecified vulnerability in Qualcomm products Transient DOS while parse fils IE with length equal to 1. | 7.5 |
| 2024-01-02 | CVE-2023-33030 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in HLOS while running playready use-case. | 7.8 |
| 2024-01-02 | CVE-2023-33032 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in TZ Secure OS while requesting a memory allocation from TA region. | 7.8 |
| 2024-01-02 | CVE-2023-33033 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in Audio during playback with speaker protection. | 7.8 |
| 2024-01-02 | CVE-2023-33038 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption while receiving a message in Bus Socket Transport Server. | 7.8 |
| 2024-01-02 | CVE-2023-33040 | Unspecified vulnerability in Qualcomm products Transient DOS in Data Modem during DTLS handshake. | 7.5 |