Vulnerabilities > Qualcomm > Snapdragon 670 Mobile Firmware > High
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2025-02-03 | CVE-2024-38420 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption while configuring a Hypervisor based input virtual device. | 7.8 |
| 2024-09-02 | CVE-2024-33052 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption when user provides data for FM HCI command control operations. | 7.8 |
| 2024-09-02 | CVE-2024-33060 | Use After Free vulnerability in Qualcomm products Memory corruption when two threads try to map and unmap a single node simultaneously. | 7.8 |
| 2024-06-03 | CVE-2023-43538 | Classic Buffer Overflow vulnerability in Qualcomm products Memory corruption in TZ Secure OS while Tunnel Invoke Manager initialization. | 7.8 |
| 2024-06-03 | CVE-2023-43551 | Improper Authentication vulnerability in Qualcomm products Cryptographic issue while performing attach with a LTE network, a rogue base station can skip the authentication phase and immediately send the Security Mode Command. | 7.5 |
| 2024-05-06 | CVE-2023-33119 | Time-of-check Time-of-use (TOCTOU) Race Condition vulnerability in Qualcomm products Memory corruption while loading a VM from a signed VM image that is not coherent in the processor cache. | 7.0 |
| 2024-05-06 | CVE-2023-43530 | Integer Overflow or Wraparound vulnerability in Qualcomm products Memory corruption in HLOS while checking for the storage type. | 7.8 |
| 2024-04-01 | CVE-2023-28547 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in SPS Application while requesting for public key in sorter TA. | 7.8 |
| 2024-04-01 | CVE-2023-33023 | Classic Buffer Overflow vulnerability in Qualcomm products Memory corruption while processing finish_sign command to pass a rsp buffer. | 7.8 |
| 2024-04-01 | CVE-2024-21468 | Use After Free vulnerability in Qualcomm products Memory corruption when there is failed unmap operation in GPU. | 7.8 |