Vulnerabilities > Qualcomm > Snapdragon 670 Firmware
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2025-03-03 | CVE-2024-43051 | Improper Authorization vulnerability in Qualcomm products Information disclosure while deriving keys for a session for any Widevine use case. | 5.5 |
| 2025-03-03 | CVE-2024-43056 | Buffer Over-read vulnerability in Qualcomm products Transient DOS during hypervisor virtual I/O operation in a virtual machine. | 6.5 |
| 2024-09-02 | CVE-2024-33042 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption when Alternative Frequency offset value is set to 255. | 7.8 |
| 2024-09-02 | CVE-2024-33051 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS while processing TIM IE from beacon frame as there is no check for IE length. | 7.5 |
| 2023-09-05 | CVE-2023-28564 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in WLAN HAL while passing command parameters through WMI interfaces. | 7.8 |
| 2023-09-05 | CVE-2023-28565 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in WLAN HAL while handling command streams through WMI interfaces. | 7.8 |
| 2023-09-05 | CVE-2023-28567 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in WLAN HAL while handling command through WMI interfaces. | 7.8 |
| 2023-09-05 | CVE-2023-33021 | Use After Free vulnerability in Qualcomm products Memory corruption in Graphics while processing user packets for command submission. | 7.8 |
| 2023-07-04 | CVE-2023-21629 | Double Free vulnerability in Qualcomm products Memory Corruption in Modem due to double free while parsing the PKCS15 sim files. | 6.8 |
| 2023-07-04 | CVE-2023-21633 | Out-of-bounds Write vulnerability in Qualcomm products Memory Corruption in Linux while processing QcRilRequestImsRegisterMultiIdentityMessage request. | 7.8 |