Vulnerabilities > Qualcomm > Snapdragon 665 Mobile Platform Firmware
DATE | CVE | VULNERABILITY TITLE | RISK |
---|---|---|---|
2024-08-05 | CVE-2024-23357 | NULL Pointer Dereference vulnerability in Qualcomm products Transient DOS while importing a PKCS#8-encoded RSA key with zero bytes modulus. | 5.5 |
2024-07-01 | CVE-2024-21461 | Double Free vulnerability in Qualcomm products Memory corruption while performing finish HMAC operation when context is freed by keymaster. | 7.8 |
2024-07-01 | CVE-2024-21462 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS while loading the TA ELF file. | 5.5 |
2024-07-01 | CVE-2024-21465 | Out-of-bounds Read vulnerability in Qualcomm products Memory corruption while processing key blob passed by the user. | 7.8 |
2024-07-01 | CVE-2024-21469 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption when an invoke call and a TEE call are bound for the same trusted application. | 7.8 |
2024-02-06 | CVE-2023-33072 | Classic Buffer Overflow vulnerability in Qualcomm products Memory corruption in Core while processing control functions. | 7.8 |
2024-02-06 | CVE-2023-43518 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in video while parsing invalid mp2 clip. | 9.8 |
2024-02-06 | CVE-2023-43519 | Classic Buffer Overflow vulnerability in Qualcomm products Memory corruption in video while parsing the Videoinfo, when the size of atom is greater than the videoinfo size. | 9.8 |
2024-01-02 | CVE-2023-33030 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in HLOS while running playready use-case. | 7.8 |
2024-01-02 | CVE-2023-33032 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in TZ Secure OS while requesting a memory allocation from TA region. | 7.8 |