Vulnerabilities > Qualcomm > Snapdragon 665 Firmware
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2025-03-03 | CVE-2024-38426 | Improper Authentication vulnerability in Qualcomm products While processing the authentication message in UE, improper authentication may lead to information disclosure. | 5.3 |
| 2025-03-03 | CVE-2024-43051 | Improper Authorization vulnerability in Qualcomm products Information disclosure while deriving keys for a session for any Widevine use case. | 5.5 |
| 2024-09-02 | CVE-2024-33051 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS while processing TIM IE from beacon frame as there is no check for IE length. | 7.5 |
| 2023-09-05 | CVE-2023-28564 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in WLAN HAL while passing command parameters through WMI interfaces. | 7.8 |
| 2023-09-05 | CVE-2023-28565 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in WLAN HAL while handling command streams through WMI interfaces. | 7.8 |
| 2023-09-05 | CVE-2023-28567 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in WLAN HAL while handling command through WMI interfaces. | 7.8 |
| 2023-07-04 | CVE-2023-21629 | Double Free vulnerability in Qualcomm products Memory Corruption in Modem due to double free while parsing the PKCS15 sim files. | 6.8 |
| 2023-07-04 | CVE-2023-21631 | Unspecified vulnerability in Qualcomm products Weak Configuration due to improper input validation in Modem while processing LTE security mode command message received from network. | 9.8 |
| 2023-07-04 | CVE-2023-22387 | Unspecified vulnerability in Qualcomm products Arbitrary memory overwrite when VM gets compromised in TX write leading to Memory Corruption. | 7.8 |
| 2023-07-04 | CVE-2023-22667 | Integer Overflow or Wraparound vulnerability in Qualcomm products Memory Corruption in Audio while allocating the ion buffer during the music playback. | 7.8 |