Vulnerabilities > Qualcomm > Snapdragon 630 Mobile Platform Firmware
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2023-06-06 | CVE-2022-40521 | Improper Authentication vulnerability in Qualcomm products Transient DOS due to improper authorization in Modem | 7.5 |
| 2023-06-06 | CVE-2023-21628 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in WLAN HAL while processing WMI-UTF command or FTM TLV1 command. | 7.8 |
| 2023-05-02 | CVE-2022-40504 | Reachable Assertion vulnerability in Qualcomm products Transient DOS due to reachable assertion in Modem when UE received Downlink Data Indication message from the network. | 7.5 |
| 2023-05-02 | CVE-2023-21665 | Incorrect Type Conversion or Cast vulnerability in Qualcomm products Memory corruption in Graphics while importing a file. | 7.8 |
| 2023-04-13 | CVE-2022-33231 | Double Free vulnerability in Qualcomm products Memory corruption due to double free in core while initializing the encryption key. | 7.8 |
| 2023-04-13 | CVE-2022-33289 | Improper Validation of Array Index vulnerability in Qualcomm products Memory corruption occurs in Modem due to improper validation of array index when malformed APDU is sent from card. | 6.8 |
| 2023-04-13 | CVE-2022-33302 | Improper Validation of Array Index vulnerability in Qualcomm products Memory corruption due to improper validation of array index in User Identity Module when APN TLV length is greater than command length. | 7.8 |
| 2023-04-13 | CVE-2022-40532 | Integer Overflow or Wraparound vulnerability in Qualcomm products Memory corruption due to integer overflow or wraparound in WLAN while sending WMI cmd from host to target. | 7.8 |