Vulnerabilities > Qualcomm > Snapdragon 625 Mobile Platform Firmware > High
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2024-07-01 | CVE-2024-21461 | Double Free vulnerability in Qualcomm products Memory corruption while performing finish HMAC operation when context is freed by keymaster. | 7.8 |
| 2024-02-06 | CVE-2023-43513 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption while processing the event ring, the context read pointer is untrusted to HLOS and when it is passed with arbitrary values, may point to address in the middle of ring element. | 7.8 |
| 2024-01-02 | CVE-2023-33030 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in HLOS while running playready use-case. | 7.8 |
| 2024-01-02 | CVE-2023-33033 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in Audio during playback with speaker protection. | 7.8 |
| 2024-01-02 | CVE-2023-33110 | Race Condition vulnerability in Qualcomm products The session index variable in PCM host voice audio driver initialized before PCM open, accessed during event callback from ADSP and reset during PCM close may lead to race condition between event callback - PCM close and reset session index causing memory corruption. | 7.0 |
| 2023-12-05 | CVE-2023-28546 | Classic Buffer Overflow vulnerability in Qualcomm products Memory Corruption in SPS Application while exporting public key in sorter TA. | 7.8 |
| 2023-12-05 | CVE-2023-28588 | Integer Overflow or Wraparound vulnerability in Qualcomm products Transient DOS in Bluetooth Host while rfc slot allocation. | 7.5 |
| 2023-12-05 | CVE-2023-33063 | Use After Free vulnerability in Qualcomm products Memory corruption in DSP Services during a remote call from HLOS to DSP. | 7.8 |
| 2023-12-05 | CVE-2023-33107 | Integer Overflow or Wraparound vulnerability in Qualcomm products Memory corruption in Graphics Linux while assigning shared virtual memory region during IOCTL call. | 7.8 |
| 2023-11-07 | CVE-2023-33059 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in Audio while processing the VOC packet data from ADSP. | 7.8 |