Vulnerabilities > Qualcomm > Snapdragon 625 Mobile Platform Firmware

DATE CVE VULNERABILITY TITLE RISK
2024-11-04 CVE-2024-38422 Unspecified vulnerability in Qualcomm products
Memory corruption while processing voice packet with arbitrary data received from ADSP.
local
low complexity
qualcomm
7.8
2024-11-04 CVE-2024-38423 Classic Buffer Overflow vulnerability in Qualcomm products
Memory corruption while processing GPU page table switch.
local
low complexity
qualcomm CWE-120
7.8
2024-08-05 CVE-2024-23357 NULL Pointer Dereference vulnerability in Qualcomm products
Transient DOS while importing a PKCS#8-encoded RSA key with zero bytes modulus.
local
low complexity
qualcomm CWE-476
5.5
2024-07-01 CVE-2024-21461 Double Free vulnerability in Qualcomm products
Memory corruption while performing finish HMAC operation when context is freed by keymaster.
local
low complexity
qualcomm CWE-415
7.8
2024-01-02 CVE-2023-33030 Out-of-bounds Write vulnerability in Qualcomm products
Memory corruption in HLOS while running playready use-case.
local
low complexity
qualcomm CWE-787
7.8
2024-01-02 CVE-2023-33033 Out-of-bounds Write vulnerability in Qualcomm products
Memory corruption in Audio during playback with speaker protection.
local
low complexity
qualcomm CWE-787
7.8
2024-01-02 CVE-2023-33110 Race Condition vulnerability in Qualcomm products
The session index variable in PCM host voice audio driver initialized before PCM open, accessed during event callback from ADSP and reset during PCM close may lead to race condition between event callback - PCM close and reset session index causing memory corruption.
local
high complexity
qualcomm CWE-362
7.0
2023-12-05 CVE-2023-28546 Classic Buffer Overflow vulnerability in Qualcomm products
Memory Corruption in SPS Application while exporting public key in sorter TA.
local
low complexity
qualcomm CWE-120
7.8
2023-12-05 CVE-2023-28588 Integer Overflow or Wraparound vulnerability in Qualcomm products
Transient DOS in Bluetooth Host while rfc slot allocation.
network
low complexity
qualcomm CWE-190
7.5
2023-12-05 CVE-2023-33063 Use After Free vulnerability in Qualcomm products
Memory corruption in DSP Services during a remote call from HLOS to DSP.
local
low complexity
qualcomm CWE-416
7.8