Vulnerabilities > Qualcomm > Snapdragon 4 GEN 2 Mobile Platform Firmware
DATE | CVE | VULNERABILITY TITLE | RISK |
---|---|---|---|
2024-02-06 | CVE-2023-43519 | Classic Buffer Overflow vulnerability in Qualcomm products Memory corruption in video while parsing the Videoinfo, when the size of atom is greater than the videoinfo size. | 9.8 |
2024-02-06 | CVE-2023-43522 | NULL Pointer Dereference vulnerability in Qualcomm products Transient DOS while key unwrapping process, when the given encrypted key is empty or NULL. | 7.5 |
2024-02-06 | CVE-2023-43533 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS in WLAN Firmware when the length of received beacon is less than length of ieee802.11 beacon frame. | 7.5 |
2024-02-06 | CVE-2023-43536 | Unspecified vulnerability in Qualcomm products Transient DOS while parse fils IE with length equal to 1. | 7.5 |
2024-02-06 | CVE-2023-33057 | Improper Input Validation vulnerability in Qualcomm products Transient DOS in Multi-Mode Call Processor while processing UE policy container. | 7.5 |
2024-02-06 | CVE-2023-33058 | Out-of-bounds Read vulnerability in Qualcomm products Information disclosure in Modem while processing SIB5. | 9.1 |
2024-02-06 | CVE-2023-33060 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS in Core when DDR memory check is called while DDR is not initialized. | 5.5 |
2024-01-02 | CVE-2023-33062 | Unspecified vulnerability in Qualcomm products Transient DOS in WLAN Firmware while parsing a BTM request. | 7.5 |
2024-01-02 | CVE-2023-33109 | NULL Pointer Dereference vulnerability in Qualcomm products Transient DOS while processing a WMI P2P listen start command (0xD00A) sent from host. | 7.5 |
2024-01-02 | CVE-2023-33112 | Unspecified vulnerability in Qualcomm products Transient DOS when WLAN firmware receives "reassoc response" frame including RIC_DATA element. | 7.5 |