Vulnerabilities > Qualcomm > Snapdragon 208 Processor Firmware
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2024-11-04 | CVE-2024-23385 | Reachable Assertion vulnerability in Qualcomm products Transient DOS as modem reset occurs when an unexpected MAC RAR (with invalid PDU length) is seen at UE. | 6.5 |
| 2024-11-04 | CVE-2024-38422 | Unspecified vulnerability in Qualcomm products Memory corruption while processing voice packet with arbitrary data received from ADSP. | 7.8 |
| 2024-11-04 | CVE-2024-38423 | Classic Buffer Overflow vulnerability in Qualcomm products Memory corruption while processing GPU page table switch. | 7.8 |
| 2024-01-02 | CVE-2023-33030 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in HLOS while running playready use-case. | 7.8 |
| 2024-01-02 | CVE-2023-33033 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in Audio during playback with speaker protection. | 7.8 |
| 2024-01-02 | CVE-2023-33120 | Use After Free vulnerability in Qualcomm products Memory corruption in Audio when memory map command is executed consecutively in ADSP. | 7.8 |
| 2023-12-05 | CVE-2023-28550 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in MPP performance while accessing DSM watermark using external memory address. | 7.8 |
| 2023-12-05 | CVE-2023-28551 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in UTILS when modem processes memory specific Diag commands having arbitrary address values as input arguments. | 7.8 |
| 2023-12-05 | CVE-2023-28586 | Improper Restriction of Operations within the Bounds of a Memory Buffer vulnerability in Qualcomm products Information disclosure when the trusted application metadata symbol addresses are accessed while loading an ELF in TEE. | 6.5 |
| 2023-12-05 | CVE-2023-28588 | Integer Overflow or Wraparound vulnerability in Qualcomm products Transient DOS in Bluetooth Host while rfc slot allocation. | 7.5 |