Vulnerabilities > Qualcomm > Smb358S Firmware > High
DATE | CVE | VULNERABILITY TITLE | RISK |
---|---|---|---|
2021-06-09 | CVE-2020-11235 | Integer Overflow or Wraparound vulnerability in Qualcomm products Buffer overflow might occur while parsing unified command due to lack of check of input data received in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking | 7.2 |
2021-05-07 | CVE-2021-1905 | Use After Free vulnerability in Qualcomm products Possible use after free due to improper handling of memory mapping of multiple processes simultaneously. | 7.2 |
2021-04-07 | CVE-2020-11255 | Memory Leak vulnerability in Qualcomm products Denial of service while processing RTCP packets containing multiple SDES reports due to memory for last SDES packet is freed and rest of the memory is leaked in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Wearables | 7.8 |
2021-04-07 | CVE-2020-11234 | Use After Free vulnerability in Qualcomm products When sending a socket event message to a user application, invalid information will be passed if socket is freed by other thread resulting in a Use After Free condition in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 7.2 |
2021-03-17 | CVE-2020-11309 | Use After Free vulnerability in Qualcomm products Use after free in GPU driver while mapping the user memory to GPU memory due to improper check of referenced memory in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 7.2 |
2021-03-17 | CVE-2020-11227 | Improper Validation of Array Index vulnerability in Qualcomm products Out of bound write while parsing RTT/TTY packet parsing due to lack of check of buffer size before copying into buffer in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 7.5 |
2021-02-22 | CVE-2020-11296 | Reachable Assertion vulnerability in Qualcomm products Arithmetic overflow can happen while processing NOA IE due to improper error handling in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking | 7.5 |
2021-02-22 | CVE-2020-11269 | Integer Overflow or Wraparound vulnerability in Qualcomm products Possible memory corruption while processing EAPOL frames due to lack of validation of key length before using it in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking | 8.3 |
2021-02-22 | CVE-2020-11177 | Unspecified vulnerability in Qualcomm products User can overwrite Security Code NV item without knowing current SPC due to improper validation of SPC code setting and device lock in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 7.2 |