Vulnerabilities > Qualcomm > Smb1351 Firmware > High
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2021-05-07 | CVE-2021-1905 | Use After Free vulnerability in Qualcomm products Possible use after free due to improper handling of memory mapping of multiple processes simultaneously. | 7.8 |
| 2021-05-07 | CVE-2021-1915 | Classic Buffer Overflow vulnerability in Qualcomm products Buffer overflow can occur due to improper validation of NDP application information length in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking | 7.8 |
| 2021-05-07 | CVE-2021-1925 | Reachable Assertion vulnerability in Qualcomm products Possible denial of service scenario due to improper handling of group management action frame in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking | 7.5 |
| 2021-05-07 | CVE-2021-1927 | Use After Free vulnerability in Qualcomm products Possible use after free due to lack of null check while memory is being freed in FastRPC driver in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking | 7.8 |
| 2021-04-07 | CVE-2021-1892 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption due to improper input validation while processing IO control which is nonstandard in Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Wired Infrastructure and Networking | 7.8 |
| 2021-04-07 | CVE-2020-11255 | Memory Leak vulnerability in Qualcomm products Denial of service while processing RTCP packets containing multiple SDES reports due to memory for last SDES packet is freed and rest of the memory is leaked in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Wearables | 7.5 |
| 2021-04-07 | CVE-2020-11246 | Double Free vulnerability in Qualcomm products A double free condition can occur when the device moves to suspend mode during secure playback in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile | 7.8 |
| 2021-04-07 | CVE-2020-11245 | Integer Overflow or Wraparound vulnerability in Qualcomm products Unintended reads and writes by NS EL2 in access control driver due to lack of check of input validation in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wired Infrastructure and Networking | 7.8 |
| 2021-04-07 | CVE-2020-11242 | Unspecified vulnerability in Qualcomm products User could gain access to secure memory due to incorrect argument into address range validation api used in SDI to capture requested contents in Snapdragon Industrial IOT, Snapdragon Mobile | 7.8 |
| 2021-04-07 | CVE-2020-11234 | Use After Free vulnerability in Qualcomm products When sending a socket event message to a user application, invalid information will be passed if socket is freed by other thread resulting in a Use After Free condition in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 7.8 |