Vulnerabilities > Qualcomm > Smart Audio 200 Platform Firmware

DATE CVE VULNERABILITY TITLE RISK
2023-06-06 CVE-2022-33264 Out-of-bounds Write vulnerability in Qualcomm products
Memory corruption in modem due to stack based buffer overflow while parsing OTASP Key Generation Request Message.
local
low complexity
qualcomm CWE-787
7.8
2023-06-06 CVE-2022-40507 Double Free vulnerability in Qualcomm products
Memory corruption due to double free in Core while mapping HLOS address to the list.
local
low complexity
qualcomm CWE-415
7.8
2023-06-06 CVE-2022-40521 Improper Authentication vulnerability in Qualcomm products
Transient DOS due to improper authorization in Modem
network
low complexity
qualcomm CWE-287
7.5
2023-06-06 CVE-2023-21628 Out-of-bounds Write vulnerability in Qualcomm products
Memory corruption in WLAN HAL while processing WMI-UTF command or FTM TLV1 command.
local
low complexity
qualcomm CWE-787
7.8
2023-04-13 CVE-2022-33231 Double Free vulnerability in Qualcomm products
Memory corruption due to double free in core while initializing the encryption key.
local
low complexity
qualcomm CWE-415
7.8