Vulnerabilities > Qualcomm > Sm8550P Firmware > High
DATE | CVE | VULNERABILITY TITLE | RISK |
---|---|---|---|
2025-01-06 | CVE-2024-45558 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS can occur when the driver parses the per STA profile IE and tries to access the EXTN element ID without checking the IE length. | 7.5 |
2024-12-02 | CVE-2024-33056 | Out-of-bounds Read vulnerability in Qualcomm products Memory corruption when allocating and accessing an entry in an SMEM partition continuously. | 7.8 |
2024-12-02 | CVE-2024-33063 | Integer Overflow or Wraparound vulnerability in Qualcomm products Transient DOS while parsing the ML IE when a beacon with common info length of the ML IE greater than the ML IE inside which this element is present. | 7.5 |
2024-12-02 | CVE-2024-43048 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption when invalid input is passed to invoke GPU Headroom API call. | 7.8 |
2024-12-02 | CVE-2024-43052 | Unspecified vulnerability in Qualcomm products Memory corruption while processing API calls to NPU with invalid input. | 7.8 |
2024-11-04 | CVE-2024-33033 | Use After Free vulnerability in Qualcomm products Memory corruption while processing IOCTL calls to unmap the buffers. | 7.8 |
2024-11-04 | CVE-2024-38415 | Use After Free vulnerability in Qualcomm products Memory corruption while handling session errors from firmware. | 7.8 |
2024-11-04 | CVE-2024-38419 | Use After Free vulnerability in Qualcomm products Memory corruption while invoking IOCTL calls from the use-space for HGSL memory node. | 7.8 |
2024-11-04 | CVE-2024-38422 | Unspecified vulnerability in Qualcomm products Memory corruption while processing voice packet with arbitrary data received from ADSP. | 7.8 |
2024-11-04 | CVE-2024-38424 | Use After Free vulnerability in Qualcomm products Memory corruption during GNSS HAL process initialization. | 7.8 |