Vulnerabilities > Qualcomm > Sm8550P Firmware
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2025-05-06 | CVE-2025-21453 | Use After Free vulnerability in Qualcomm products Memory corruption while processing a data structure, when an iterator is accessed after it has been removed, potential failures occur. | 7.8 |
| 2025-05-06 | CVE-2025-21459 | Buffer Over-read vulnerability in Qualcomm products Transient DOS while parsing per STA profile in ML IE. | 7.5 |
| 2025-05-06 | CVE-2025-21468 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption while reading response from FW, when buffer size is changed by FW while driver is using this size to write null character at the end of buffer. | 7.8 |
| 2025-03-03 | CVE-2024-43051 | Improper Authorization vulnerability in Qualcomm products Information disclosure while deriving keys for a session for any Widevine use case. | 5.5 |
| 2025-03-03 | CVE-2024-43056 | Buffer Over-read vulnerability in Qualcomm products Transient DOS during hypervisor virtual I/O operation in a virtual machine. | 6.5 |
| 2025-03-03 | CVE-2024-53014 | Improper Validation of Array Index vulnerability in Qualcomm products Memory corruption may occur while validating ports and channels in Audio driver. | 7.8 |
| 2025-03-03 | CVE-2024-53023 | Use After Free vulnerability in Qualcomm products Memory corruption may occur while accessing a variable during extended back to back tests. | 7.8 |
| 2025-03-03 | CVE-2024-53024 | NULL Pointer Dereference vulnerability in Qualcomm products Memory corruption in display driver while detaching a device. | 7.8 |
| 2025-03-03 | CVE-2024-53027 | Classic Buffer Overflow vulnerability in Qualcomm products Transient DOS may occur while processing the country IE. | 7.5 |
| 2025-03-03 | CVE-2025-21424 | Use After Free vulnerability in Qualcomm products Memory corruption while calling the NPU driver APIs concurrently. | 7.8 |