Vulnerabilities > Qualcomm > Sm8450 Firmware
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2023-04-13 | CVE-2022-33270 | Time-of-check Time-of-use (TOCTOU) Race Condition vulnerability in Qualcomm products Transient DOS due to time-of-check time-of-use race condition in Modem while processing RRC Reconfiguration message. | 5.9 |
| 2023-04-13 | CVE-2022-33288 | Classic Buffer Overflow vulnerability in Qualcomm products Memory corruption due to buffer copy without checking the size of input in Core while sending SCM command to get write protection information. | 8.8 |
| 2023-04-13 | CVE-2022-33289 | Improper Validation of Array Index vulnerability in Qualcomm products Memory corruption occurs in Modem due to improper validation of array index when malformed APDU is sent from card. | 6.8 |
| 2023-04-13 | CVE-2022-33296 | Integer Overflow or Wraparound vulnerability in Qualcomm products Memory corruption due to integer overflow to buffer overflow in Modem while parsing Traffic Channel Neighbor List Update message. | 7.8 |
| 2023-04-13 | CVE-2022-33302 | Improper Validation of Array Index vulnerability in Qualcomm products Memory corruption due to improper validation of array index in User Identity Module when APN TLV length is greater than command length. | 7.8 |
| 2023-04-13 | CVE-2022-40503 | Out-of-bounds Read vulnerability in Qualcomm products Information disclosure due to buffer over-read in Bluetooth Host while A2DP streaming. | 7.5 |
| 2023-04-13 | CVE-2022-40532 | Integer Overflow or Wraparound vulnerability in Qualcomm products Memory corruption due to integer overflow or wraparound in WLAN while sending WMI cmd from host to target. | 7.8 |
| 2023-04-13 | CVE-2023-21630 | Integer Overflow or Wraparound vulnerability in Qualcomm products Memory Corruption in Multimedia Framework due to integer overflow when synx bind is called along with synx signal. | 7.8 |
| 2022-01-03 | CVE-2021-1894 | Improper Handling of Exceptional Conditions vulnerability in Qualcomm products Improper access control in TrustZone due to improper error handling while handling the signing key in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking | 7.8 |
| 2022-01-03 | CVE-2021-30267 | Integer Overflow or Wraparound vulnerability in Qualcomm products Possible integer overflow to buffer overflow due to improper input validation in FTM ARA commands in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile | 7.8 |