Vulnerabilities > Qualcomm > Sm8350 AC Firmware
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2023-12-05 | CVE-2023-33042 | Improper Input Validation vulnerability in Qualcomm products Transient DOS in Modem after RRC Setup message is received. | 7.5 |
| 2023-12-05 | CVE-2023-33043 | Reachable Assertion vulnerability in Qualcomm products Transient DOS in Modem when a Beam switch request is made with a non-configured BWP. | 7.5 |
| 2023-12-05 | CVE-2023-33044 | Reachable Assertion vulnerability in Qualcomm products Transient DOS in Data modem while handling TLB control messages from the Network. | 7.5 |
| 2023-12-05 | CVE-2023-33054 | Improper Authentication vulnerability in Qualcomm products Cryptographic issue in GPS HLOS Driver while downloading Qualcomm GNSS assistance data. | 9.1 |
| 2023-12-05 | CVE-2023-33063 | Use After Free vulnerability in Qualcomm products Memory corruption in DSP Services during a remote call from HLOS to DSP. | 7.8 |
| 2023-12-05 | CVE-2023-33079 | Improper Restriction of Operations within the Bounds of a Memory Buffer vulnerability in Qualcomm products Memory corruption in Audio while running invalid audio recording from ADSP. | 7.8 |
| 2023-12-05 | CVE-2023-33080 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS while parsing a vender specific IE (Information Element) of reassociation response management frame. | 7.5 |
| 2023-11-07 | CVE-2023-33047 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS in WLAN Firmware while parsing no-inherit IES. | 7.5 |
| 2023-11-07 | CVE-2023-33055 | Out-of-bounds Write vulnerability in Qualcomm products Memory Corruption in Audio while invoking callback function in driver from ADSP. | 7.8 |
| 2023-11-07 | CVE-2023-33059 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in Audio while processing the VOC packet data from ADSP. | 7.8 |