Vulnerabilities > Qualcomm > Sm8250 Firmware > Low
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2020-06-22 | CVE-2019-14092 | Information Exposure vulnerability in Qualcomm products System Services exports services without permission protect and can lead to information exposure in Snapdragon Industrial IOT, Snapdragon Mobile in MDM9206, MDM9207C, MDM9607, Rennell, Saipan, SM8150, SM8250, SXR2130 | 2.1 |
| 2020-06-02 | CVE-2019-14042 | Out-of-bounds Read vulnerability in Qualcomm products Out of bound read in in fingerprint application due to requested data assigned to a local buffer without length check in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking in Kamorta, MDM9205, Nicobar, QCS404, QCS405, QCS605, Rennell, SA415M, SA6155P, SC7180, SC8180X, SDM670, SDM710, SDM845, SDM850, SDX24, SDX55, SM6150, SM7150, SM8150, SM8250, SXR1130, SXR2130 | 3.6 |
| 2020-06-02 | CVE-2019-14043 | Out-of-bounds Read vulnerability in Qualcomm products Out of bound read in Fingerprint application due to requested data is being used without length check in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking in Kamorta, MDM9150, MDM9205, MDM9650, MSM8998, Nicobar, QCS404, QCS405, QCS605, Rennell, SA415M, SA6155P, SC7180, SC8180X, SDA660, SDM630, SDM636, SDM660, SDM670, SDM710, SDM845, SDM850, SDX24, SDX55, SM6150, SM7150, SM8150, SM8250, SXR1130, SXR2130 | 3.6 |
| 2020-06-02 | CVE-2019-14053 | Out-of-bounds Read vulnerability in Qualcomm products When attempting to create a new XFRM policy, a stack out-of-bounds read will occur if the user provides a template where the mode is set to a value that does not resolve to a valid XFRM mode in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking in APQ8009, APQ8053, APQ8096AU, APQ8098, IPQ4019, IPQ8074, MDM9206, MDM9207C, MDM9607, MDM9640, MDM9650, MSM8905, MSM8909W, MSM8917, MSM8953, MSM8996AU, QCA4531, QCN7605, QCS605, QM215, SA415M, SC8180X, SDA660, SDA845, SDM429, SDM429W, SDM439, SDM450, SDM630, SDM632, SDM636, SDM660, SDM845, SDX20, SDX24, SDX55, SM6150, SM7150, SM8150, SM8250, SXR2130 | 3.6 |
| 2020-04-16 | CVE-2019-10523 | Information Exposure vulnerability in Qualcomm products Target specific data is being sent to remote server and leads to information exposure in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Wearables in APQ8009, APQ8053, APQ8096AU, MSM8909W, MSM8917, MSM8920, MSM8937, MSM8940, MSM8953, MSM8996AU, QCA6574AU, QCS605, Rennell, SDA660, SDM429W, SDM439, SDM450, SDM710, SDM845, SM7150, SM8150, SM8250, SXR2130 | 2.1 |
| 2020-04-16 | CVE-2019-10622 | Out-of-bounds Read vulnerability in Qualcomm products Out of bound memory access can happen while parsing ADSP message due to lack of check of size of payload received from userspace in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wired Infrastructure and Networking in APQ8009, APQ8096AU, IPQ4019, IPQ6018, IPQ8064, IPQ8074, MDM9206, MDM9207C, MDM9607, MDM9640, MDM9650, QCN7605, QCS605, SC8180X, SDM710, SDX24, SDX55, SM8150, SM8250, SXR2130 | 3.6 |
| 2020-04-16 | CVE-2019-10623 | Integer Overflow or Wraparound vulnerability in Qualcomm products Possible integer overflow can happen in host driver while processing user controlled string due to improper validation on data received. | 3.6 |
| 2019-12-12 | CVE-2019-10484 | Use After Free vulnerability in Qualcomm products Use after free issue occurs when command destructors access dynamically allocated response buffer which is already deallocated during previous command teardwon sequence in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables in APQ8098, MSM8909W, Nicobar, QCS405, QCS605, SDA845, SDM660, SDM670, SDM710, SDM845, SDX24, SM6150, SM7150, SM8150, SM8250, SXR2130 | 2.1 |
| 2019-11-21 | CVE-2019-10490 | Use After Free vulnerability in Qualcomm products Use after free issue in Xtra daemon shutdown due to static object instance getting freed from a multiple places in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables in APQ8009, APQ8017, APQ8053, APQ8096AU, APQ8098, MDM9150, MDM9206, MDM9207C, MDM9607, MDM9650, MSM8905, MSM8909, MSM8909W, MSM8917, MSM8920, MSM8937, MSM8939, MSM8940, MSM8953, MSM8996, MSM8996AU, MSM8998, Nicobar, QCS605, SDA660, SDA845, SDM450, SDM660, SDM670, SDM710, SDM845, SDX20, SDX24, SM6150, SM7150, SM8150, SM8250, SXR2130 | 2.1 |