Vulnerabilities > Qualcomm > Sm7325P Firmware > High
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2022-01-03 | CVE-2021-30303 | Classic Buffer Overflow vulnerability in Qualcomm products Possible buffer overflow due to lack of buffer length check when segmented WMI command is received in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking | 7.8 |
| 2022-01-03 | CVE-2021-30336 | Out-of-bounds Read vulnerability in Qualcomm products Possible out of bound read due to lack of domain input validation while processing APK close session request in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Wearables | 7.8 |
| 2021-07-13 | CVE-2021-1886 | Out-of-bounds Write vulnerability in Qualcomm products Incorrect handling of pointers in trusted application key import mechanism could cause memory corruption in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Voice & Music, Snapdragon Wearables | 7.8 |
| 2021-07-13 | CVE-2021-1888 | Double Free vulnerability in Qualcomm products Memory corruption in key parsing and import function due to double freeing the same heap allocation in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Voice & Music, Snapdragon Wearables | 7.8 |
| 2021-07-13 | CVE-2021-1889 | Classic Buffer Overflow vulnerability in Qualcomm products Possible buffer overflow due to lack of length check in Trusted Application in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Voice & Music, Snapdragon Wearables | 7.8 |
| 2021-07-13 | CVE-2021-1890 | Out-of-bounds Write vulnerability in Qualcomm products Improper length check of public exponent in RSA import key function could cause memory corruption. | 7.8 |
| 2021-07-13 | CVE-2021-1907 | Classic Buffer Overflow vulnerability in Qualcomm products Possible buffer overflow due to lack of length check in BA request in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile | 7.5 |
| 2021-07-13 | CVE-2021-1938 | Reachable Assertion vulnerability in Qualcomm products Possible assertion due to improper verification while creating and deleting the peer in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking | 7.5 |
| 2021-07-13 | CVE-2021-1943 | Out-of-bounds Read vulnerability in Qualcomm products Possible buffer out of bound read can occur due to improper validation of TBTT count and length while parsing the beacon response in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wired Infrastructure and Networking | 7.5 |
| 2021-07-13 | CVE-2021-1945 | Out-of-bounds Read vulnerability in Qualcomm products Possible out of bound read due to lack of length check of Bandwidth-NSS IE in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking | 7.5 |