Vulnerabilities > Qualcomm > Sm7325P Firmware > High
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2022-10-19 | CVE-2022-25749 | Out-of-bounds Read vulnerability in Qualcomm products Transient Denial-of-Service in WLAN due to buffer over-read while parsing MDNS frames. | 7.5 |
| 2022-10-19 | CVE-2022-33214 | Time-of-check Time-of-use (TOCTOU) Race Condition vulnerability in Qualcomm products Memory corruption in display due to time-of-check time-of-use of metadata reserved size in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables | 7.0 |
| 2022-09-16 | CVE-2022-22066 | Out-of-bounds Read vulnerability in Qualcomm products Memory corruption occurs while processing command received from HLOS due to improper length check in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 7.8 |
| 2022-09-16 | CVE-2022-22092 | Use After Free vulnerability in Qualcomm products Memory corruption in kernel due to use after free issue in Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile | 7.8 |
| 2022-09-16 | CVE-2022-22093 | Time-of-check Time-of-use (TOCTOU) Race Condition vulnerability in Qualcomm products Memory corruption or temporary denial of service due to improper handling of concurrent hypervisor operations to attach or detach IRQs from virtual interrupt sources in Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile | 7.0 |
| 2022-09-16 | CVE-2022-22094 | Time-of-check Time-of-use (TOCTOU) Race Condition vulnerability in Qualcomm products memory corruption in Kernel due to race condition while getting mapping reference in Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile | 7.0 |
| 2022-09-16 | CVE-2022-25656 | Integer Overflow or Wraparound vulnerability in Qualcomm products Possible integer overflow and memory corruption due to improper validation of buffer size sent to write to console when computing the payload size in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables | 7.8 |
| 2022-09-16 | CVE-2022-25669 | Out-of-bounds Read vulnerability in Qualcomm products Denial of service in video due to buffer over read while parsing MP4 clip in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 7.5 |
| 2022-09-16 | CVE-2022-25690 | Improper Validation of Array Index vulnerability in Qualcomm products Information disclosure in WLAN due to improper validation of array index while parsing crafted ANQP action frames in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music | 7.5 |
| 2022-09-16 | CVE-2022-25696 | Time-of-check Time-of-use (TOCTOU) Race Condition vulnerability in Qualcomm products Memory corruption in display due to time-of-check time-of-use race condition during map or unmap in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables | 7.0 |