Vulnerabilities > Qualcomm > Sm7325P Firmware > Critical

DATE CVE VULNERABILITY TITLE RISK
2022-06-14 CVE-2021-30341 Out-of-bounds Write vulnerability in Qualcomm products
Improper buffer size validation of DSM packet received can lead to memory corruption in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Wearables
network
low complexity
qualcomm CWE-787
critical
10.0
2022-04-01 CVE-2021-35117 Out-of-bounds Read vulnerability in Qualcomm products
An Out of Bounds read may potentially occur while processing an IBSS beacon, in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music
network
low complexity
qualcomm CWE-125
critical
9.4
2021-07-13 CVE-2021-1965 Classic Buffer Overflow vulnerability in Qualcomm products
Possible buffer overflow due to lack of parameter length check during MBSSID scan IE parse in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Mobile, Snapdragon Wired Infrastructure and Networking
network
low complexity
qualcomm CWE-120
critical
10.0
2021-07-13 CVE-2020-11307 Improper Validation of Array Index vulnerability in Qualcomm products
Buffer overflow in modem due to improper array index check before copying into it in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Wearables
network
low complexity
qualcomm CWE-129
critical
10.0