Vulnerabilities > Qualcomm > Sm7325P Firmware

DATE CVE VULNERABILITY TITLE RISK
2021-06-09 CVE-2020-11306 Integer Overflow or Wraparound vulnerability in Qualcomm products
Possible integer overflow in RPMB counter due to lack of length check on user provided data in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wired Infrastructure and Networking
local
low complexity
qualcomm CWE-190
7.8
2021-06-09 CVE-2021-1937 Reachable Assertion vulnerability in Qualcomm products
Reachable assertion is possible while processing peer association WLAN message from host and nonstandard incoming packet in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking
network
low complexity
qualcomm CWE-617
7.5