Vulnerabilities > Qualcomm > Sm7325P Firmware

DATE CVE VULNERABILITY TITLE RISK
2022-06-14 CVE-2021-30339 Unspecified vulnerability in Qualcomm products
Reading PRNG output may lead to improper key generation due to lack of buffer validation in Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking
local
low complexity
qualcomm
5.5
2022-06-14 CVE-2021-30340 Reachable Assertion vulnerability in Qualcomm products
Reachable assertion due to improper validation of coreset in PDCCH configuration in SA mode in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile
network
low complexity
qualcomm CWE-617
7.5
2022-06-14 CVE-2021-30341 Out-of-bounds Write vulnerability in Qualcomm products
Improper buffer size validation of DSM packet received can lead to memory corruption in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Wearables
network
low complexity
qualcomm CWE-787
critical
9.8
2022-06-14 CVE-2021-30343 Time-of-check Time-of-use (TOCTOU) Race Condition vulnerability in Qualcomm products
Improper integrity check can lead to race condition between tasks PDCP and RRC? after a valid RRC Command packet has been received in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile
network
high complexity
qualcomm CWE-367
5.9
2022-06-14 CVE-2021-30344 Unspecified vulnerability in Qualcomm products
Improper authorization of a replayed LTE security mode command can lead to a denial of service in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables
network
low complexity
qualcomm
7.5
2022-06-14 CVE-2021-30347 Time-of-check Time-of-use (TOCTOU) Race Condition vulnerability in Qualcomm products
Improper integrity check can lead to race condition between tasks PDCP and RRC? right after a valid RRC Command packet has been received in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile
network
high complexity
qualcomm CWE-367
8.1
2022-06-14 CVE-2021-30349 Unspecified vulnerability in Qualcomm products
Improper access control sequence for AC database after memory allocation can lead to possible memory corruption in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking
local
low complexity
qualcomm
6.7
2022-06-14 CVE-2021-30350 Improper Validation of Specified Quantity in Input vulnerability in Qualcomm products
Lack of MBN header size verification against input buffer can lead to memory corruption in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Wearables
local
low complexity
qualcomm CWE-1284
7.8
2022-06-14 CVE-2021-35071 Out-of-bounds Read vulnerability in Qualcomm products
Possible buffer over read due to lack of size validation while copying data from DBR buffer to RX buffer and can lead to Denial of Service in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking
local
low complexity
qualcomm CWE-125
5.5
2022-06-14 CVE-2021-35073 Reachable Assertion vulnerability in Qualcomm products
Possible assertion due to improper validation of rank restriction field in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile
network
low complexity
qualcomm CWE-617
7.5