Vulnerabilities > Qualcomm > Sm7325P Firmware
DATE | CVE | VULNERABILITY TITLE | RISK |
---|---|---|---|
2022-06-14 | CVE-2021-30339 | Unspecified vulnerability in Qualcomm products Reading PRNG output may lead to improper key generation due to lack of buffer validation in Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking | 5.5 |
2022-06-14 | CVE-2021-30340 | Reachable Assertion vulnerability in Qualcomm products Reachable assertion due to improper validation of coreset in PDCCH configuration in SA mode in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile | 7.5 |
2022-06-14 | CVE-2021-30341 | Out-of-bounds Write vulnerability in Qualcomm products Improper buffer size validation of DSM packet received can lead to memory corruption in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Wearables | 9.8 |
2022-06-14 | CVE-2021-30343 | Time-of-check Time-of-use (TOCTOU) Race Condition vulnerability in Qualcomm products Improper integrity check can lead to race condition between tasks PDCP and RRC? after a valid RRC Command packet has been received in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile | 5.9 |
2022-06-14 | CVE-2021-30344 | Unspecified vulnerability in Qualcomm products Improper authorization of a replayed LTE security mode command can lead to a denial of service in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 7.5 |
2022-06-14 | CVE-2021-30347 | Time-of-check Time-of-use (TOCTOU) Race Condition vulnerability in Qualcomm products Improper integrity check can lead to race condition between tasks PDCP and RRC? right after a valid RRC Command packet has been received in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile | 8.1 |
2022-06-14 | CVE-2021-30349 | Unspecified vulnerability in Qualcomm products Improper access control sequence for AC database after memory allocation can lead to possible memory corruption in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking | 6.7 |
2022-06-14 | CVE-2021-30350 | Improper Validation of Specified Quantity in Input vulnerability in Qualcomm products Lack of MBN header size verification against input buffer can lead to memory corruption in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Wearables | 7.8 |
2022-06-14 | CVE-2021-35071 | Out-of-bounds Read vulnerability in Qualcomm products Possible buffer over read due to lack of size validation while copying data from DBR buffer to RX buffer and can lead to Denial of Service in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking | 5.5 |
2022-06-14 | CVE-2021-35073 | Reachable Assertion vulnerability in Qualcomm products Possible assertion due to improper validation of rank restriction field in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile | 7.5 |