Vulnerabilities > Qualcomm > Sm7325P Firmware
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2023-03-10 | CVE-2022-33242 | Improper Authentication vulnerability in Qualcomm products Memory corruption due to improper authentication in Qualcomm IPC while loading unsigned lib in audio PD. | 7.8 |
| 2023-03-10 | CVE-2022-33244 | Reachable Assertion vulnerability in Qualcomm products Transient DOS due to reachable assertion in modem during MIB reception and SIB timeout | 7.5 |
| 2023-03-10 | CVE-2022-33250 | Reachable Assertion vulnerability in Qualcomm products Transient DOS due to reachable assertion in modem when network repeatedly sent invalid message container for NR to LTE handover. | 7.5 |
| 2023-03-10 | CVE-2022-33254 | Reachable Assertion vulnerability in Qualcomm products Transient DOS due to reachable assertion in Modem while processing SIB1 Message. | 7.5 |
| 2023-03-10 | CVE-2022-33256 | Improper Validation of Array Index vulnerability in Qualcomm products Memory corruption due to improper validation of array index in Multi-mode call processor. | 9.8 |
| 2023-03-10 | CVE-2022-33257 | Time-of-check Time-of-use (TOCTOU) Race Condition vulnerability in Qualcomm products Memory corruption in Core due to time-of-check time-of-use race condition during dump collection in trust zone. | 7.0 |
| 2023-03-10 | CVE-2022-33272 | Reachable Assertion vulnerability in Qualcomm products Transient DOS in modem due to reachable assertion. | 7.5 |
| 2023-03-10 | CVE-2022-33278 | Classic Buffer Overflow vulnerability in Qualcomm products Memory corruption due to buffer copy without checking the size of input in HLOS when input message size is larger than the buffer capacity. | 7.8 |
| 2023-03-10 | CVE-2022-40515 | Double Free vulnerability in Qualcomm products Memory corruption in Video due to double free while playing 3gp clip with invalid metadata atoms. | 9.8 |
| 2023-03-10 | CVE-2022-40527 | Reachable Assertion vulnerability in Qualcomm products Transient DOS due to reachable assertion in WLAN while processing PEER ID populated by TQM. | 7.5 |