Vulnerabilities > Qualcomm > Sm7325 Firmware > High

DATE CVE VULNERABILITY TITLE RISK
2023-05-02 CVE-2023-21665 Incorrect Type Conversion or Cast vulnerability in Qualcomm products
Memory corruption in Graphics while importing a file.
local
low complexity
qualcomm CWE-704
7.8
2023-04-13 CVE-2022-33231 Double Free vulnerability in Qualcomm products
Memory corruption due to double free in core while initializing the encryption key.
local
low complexity
qualcomm CWE-415
7.8
2023-04-13 CVE-2022-33288 Classic Buffer Overflow vulnerability in Qualcomm products
Memory corruption due to buffer copy without checking the size of input in Core while sending SCM command to get write protection information.
local
low complexity
qualcomm CWE-120
8.8
2023-04-13 CVE-2022-33302 Improper Validation of Array Index vulnerability in Qualcomm products
Memory corruption due to improper validation of array index in User Identity Module when APN TLV length is greater than command length.
local
low complexity
qualcomm CWE-129
7.8
2023-04-13 CVE-2022-40503 Out-of-bounds Read vulnerability in Qualcomm products
Information disclosure due to buffer over-read in Bluetooth Host while A2DP streaming.
network
low complexity
qualcomm CWE-125
7.5
2023-04-13 CVE-2022-40532 Integer Overflow or Wraparound vulnerability in Qualcomm products
Memory corruption due to integer overflow or wraparound in WLAN while sending WMI cmd from host to target.
local
low complexity
qualcomm CWE-190
7.8
2023-04-13 CVE-2023-21630 Integer Overflow or Wraparound vulnerability in Qualcomm products
Memory Corruption in Multimedia Framework due to integer overflow when synx bind is called along with synx signal.
local
low complexity
qualcomm CWE-190
7.8
2022-09-02 CVE-2022-22080 Out-of-bounds Write vulnerability in Qualcomm products
Improper validation of backend id in PCM routing process can lead to memory corruption in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music
local
low complexity
qualcomm CWE-787
7.8
2021-11-12 CVE-2021-1921 Time-of-check Time-of-use (TOCTOU) Race Condition vulnerability in Qualcomm products
Possible memory corruption due to Improper handling of hypervisor unmap operations for concurrent memory operations in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile
local
high complexity
qualcomm CWE-367
7.0
2021-11-12 CVE-2021-1973 Improper Restriction of Operations within the Bounds of a Memory Buffer vulnerability in Qualcomm products
A FTM Diag command can allow an arbitrary write into modem OS space in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables
local
low complexity
qualcomm CWE-119
7.8