Vulnerabilities > Qualcomm > Sm7325 AF Firmware > High
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2023-05-02 | CVE-2022-33305 | NULL Pointer Dereference vulnerability in Qualcomm products Transient DOS due to NULL pointer dereference in Modem while sending invalid messages in DCCH. | 7.5 |
| 2023-05-02 | CVE-2022-34144 | Reachable Assertion vulnerability in Qualcomm products Transient DOS due to reachable assertion in Modem during OSI decode scheduling. | 7.5 |
| 2023-05-02 | CVE-2023-21665 | Incorrect Type Conversion or Cast vulnerability in Qualcomm products Memory corruption in Graphics while importing a file. | 7.8 |
| 2023-04-13 | CVE-2022-33231 | Double Free vulnerability in Qualcomm products Memory corruption due to double free in core while initializing the encryption key. | 7.8 |
| 2023-04-13 | CVE-2022-33288 | Classic Buffer Overflow vulnerability in Qualcomm products Memory corruption due to buffer copy without checking the size of input in Core while sending SCM command to get write protection information. | 8.8 |
| 2023-04-13 | CVE-2022-33302 | Improper Validation of Array Index vulnerability in Qualcomm products Memory corruption due to improper validation of array index in User Identity Module when APN TLV length is greater than command length. | 7.8 |
| 2023-04-13 | CVE-2022-40503 | Out-of-bounds Read vulnerability in Qualcomm products Information disclosure due to buffer over-read in Bluetooth Host while A2DP streaming. | 7.5 |
| 2023-04-13 | CVE-2022-40532 | Integer Overflow or Wraparound vulnerability in Qualcomm products Memory corruption due to integer overflow or wraparound in WLAN while sending WMI cmd from host to target. | 7.8 |
| 2023-04-13 | CVE-2023-21630 | Integer Overflow or Wraparound vulnerability in Qualcomm products Memory Corruption in Multimedia Framework due to integer overflow when synx bind is called along with synx signal. | 7.8 |