Vulnerabilities > Qualcomm > Sm7315 Firmware > Medium

DATE CVE VULNERABILITY TITLE RISK
2022-09-16 CVE-2022-25653 Out-of-bounds Read vulnerability in Qualcomm products
Information disclosure in video due to buffer over-read while processing avi file in Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables
local
low complexity
qualcomm CWE-125
5.5
2022-09-02 CVE-2021-35097 Improper Verification of Cryptographic Signature vulnerability in Qualcomm products
Possible authentication bypass due to improper order of signature verification and hashing in the signature verification call in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables
low complexity
qualcomm CWE-347
6.8
2022-09-02 CVE-2021-35135 NULL Pointer Dereference vulnerability in Qualcomm products
A null pointer dereference may potentially occur during RSA key import in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables
local
low complexity
qualcomm CWE-476
5.5
2022-06-14 CVE-2021-30339 Unspecified vulnerability in Qualcomm products
Reading PRNG output may lead to improper key generation due to lack of buffer validation in Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking
local
low complexity
qualcomm
5.5
2022-06-14 CVE-2021-30343 Time-of-check Time-of-use (TOCTOU) Race Condition vulnerability in Qualcomm products
Improper integrity check can lead to race condition between tasks PDCP and RRC? after a valid RRC Command packet has been received in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile
network
high complexity
qualcomm CWE-367
5.9
2022-01-13 CVE-2021-30313 Use After Free vulnerability in Qualcomm products
Use after free condition can occur in wired connectivity due to a race condition while creating and deleting folders in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking
local
high complexity
qualcomm CWE-416
6.4
2022-01-13 CVE-2021-30314 Information Exposure vulnerability in Qualcomm products
Lack of validation for third party application accessing the service can lead to information disclosure in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables
local
low complexity
qualcomm CWE-200
5.5
2022-01-03 CVE-2021-30348 Resource Exhaustion vulnerability in Qualcomm products
Improper validation of LLM utility timers availability can lead to denial of service in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music
low complexity
qualcomm CWE-400
6.5
2021-07-13 CVE-2021-1931 Classic Buffer Overflow vulnerability in Qualcomm products
Possible buffer overflow due to improper validation of buffer length while processing fast boot commands in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music
local
low complexity
qualcomm CWE-120
6.7