Vulnerabilities > Qualcomm > Sm7315 Firmware > Medium
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2022-11-15 | CVE-2022-25676 | Out-of-bounds Read vulnerability in Qualcomm products Information disclosure in video due to buffer over-read while parsing avi files in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables | 5.5 |
| 2022-11-15 | CVE-2022-25679 | Unspecified vulnerability in Qualcomm products Denial of service in video due to improper access control in broadcast receivers in Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables | 5.5 |
| 2022-09-16 | CVE-2022-25653 | Out-of-bounds Read vulnerability in Qualcomm products Information disclosure in video due to buffer over-read while processing avi file in Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables | 5.5 |
| 2022-09-02 | CVE-2021-35097 | Improper Verification of Cryptographic Signature vulnerability in Qualcomm products Possible authentication bypass due to improper order of signature verification and hashing in the signature verification call in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 6.8 |
| 2022-09-02 | CVE-2021-35135 | NULL Pointer Dereference vulnerability in Qualcomm products A null pointer dereference may potentially occur during RSA key import in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 5.5 |
| 2022-06-14 | CVE-2021-30339 | Unspecified vulnerability in Qualcomm products Reading PRNG output may lead to improper key generation due to lack of buffer validation in Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking | 5.5 |
| 2022-06-14 | CVE-2021-30343 | Time-of-check Time-of-use (TOCTOU) Race Condition vulnerability in Qualcomm products Improper integrity check can lead to race condition between tasks PDCP and RRC? after a valid RRC Command packet has been received in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile | 5.9 |
| 2022-01-13 | CVE-2021-30313 | Use After Free vulnerability in Qualcomm products Use after free condition can occur in wired connectivity due to a race condition while creating and deleting folders in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking | 6.4 |
| 2022-01-13 | CVE-2021-30314 | Information Exposure vulnerability in Qualcomm products Lack of validation for third party application accessing the service can lead to information disclosure in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables | 5.5 |
| 2022-01-03 | CVE-2021-30348 | Resource Exhaustion vulnerability in Qualcomm products Improper validation of LLM utility timers availability can lead to denial of service in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music | 6.5 |