Vulnerabilities > Qualcomm > Sm7315 Firmware > Medium
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2024-09-02 | CVE-2024-33043 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS while handling PS event when Program Service name length offset value is set to 255. | 5.5 |
| 2024-08-05 | CVE-2024-23357 | NULL Pointer Dereference vulnerability in Qualcomm products Transient DOS while importing a PKCS#8-encoded RSA key with zero bytes modulus. | 5.5 |
| 2024-07-01 | CVE-2024-21462 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS while loading the TA ELF file. | 5.5 |
| 2023-12-05 | CVE-2023-28586 | Improper Restriction of Operations within the Bounds of a Memory Buffer vulnerability in Qualcomm products Information disclosure when the trusted application metadata symbol addresses are accessed while loading an ELF in TEE. | 6.5 |
| 2023-07-04 | CVE-2023-21624 | Unspecified vulnerability in Qualcomm products Information disclosure in DSP Services while loading dynamic module. | 5.5 |
| 2023-07-04 | CVE-2023-21629 | Double Free vulnerability in Qualcomm products Memory Corruption in Modem due to double free while parsing the PKCS15 sim files. | 6.8 |
| 2023-06-06 | CVE-2022-22076 | Unspecified vulnerability in Qualcomm products information disclosure due to cryptographic issue in Core during RPMB read request. | 5.5 |
| 2023-06-06 | CVE-2022-40523 | Exposure of Resource to Wrong Sphere vulnerability in Qualcomm products Information disclosure in Kernel due to indirect branch misprediction. | 5.5 |
| 2023-06-06 | CVE-2022-40533 | Improper Restriction of Operations within the Bounds of a Memory Buffer vulnerability in Qualcomm products Transient DOS due to untrusted Pointer Dereference in core while sending USB QMI request. | 5.5 |
| 2023-04-13 | CVE-2022-33289 | Improper Validation of Array Index vulnerability in Qualcomm products Memory corruption occurs in Modem due to improper validation of array index when malformed APDU is sent from card. | 6.8 |