Vulnerabilities > Qualcomm > Sm7315 Firmware > High
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2024-01-02 | CVE-2023-33040 | Unspecified vulnerability in Qualcomm products Transient DOS in Data Modem during DTLS handshake. | 7.5 |
| 2024-01-02 | CVE-2023-33062 | Unspecified vulnerability in Qualcomm products Transient DOS in WLAN Firmware while parsing a BTM request. | 7.5 |
| 2024-01-02 | CVE-2023-33085 | Classic Buffer Overflow vulnerability in Qualcomm products Memory corruption in wearables while processing data from AON. | 7.8 |
| 2024-01-02 | CVE-2023-33094 | Use After Free vulnerability in Qualcomm products Memory corruption while running VK synchronization with KASAN enabled. | 7.8 |
| 2024-01-02 | CVE-2023-33109 | NULL Pointer Dereference vulnerability in Qualcomm products Transient DOS while processing a WMI P2P listen start command (0xD00A) sent from host. | 7.5 |
| 2024-01-02 | CVE-2023-33112 | Unspecified vulnerability in Qualcomm products Transient DOS when WLAN firmware receives "reassoc response" frame including RIC_DATA element. | 7.5 |
| 2024-01-02 | CVE-2023-33113 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption when resource manager sends the host kernel a reply message with multiple fragments. | 7.8 |
| 2024-01-02 | CVE-2023-33117 | Use After Free vulnerability in Qualcomm products Memory corruption when HLOS allocates the response payload buffer to copy the data received from ADSP in response to AVCS_LOAD_MODULE command. | 7.8 |
| 2024-01-02 | CVE-2023-33118 | Use After Free vulnerability in Qualcomm products Memory corruption while processing Listen Sound Model client payload buffer when there is a request for Listen Sound session get parameter from ST HAL. | 7.8 |
| 2024-01-02 | CVE-2023-33120 | Use After Free vulnerability in Qualcomm products Memory corruption in Audio when memory map command is executed consecutively in ADSP. | 7.8 |