Vulnerabilities > Qualcomm > Sm7315 Firmware > High
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2022-09-16 | CVE-2022-22093 | Time-of-check Time-of-use (TOCTOU) Race Condition vulnerability in Qualcomm products Memory corruption or temporary denial of service due to improper handling of concurrent hypervisor operations to attach or detach IRQs from virtual interrupt sources in Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile | 7.0 |
| 2022-09-16 | CVE-2022-22094 | Time-of-check Time-of-use (TOCTOU) Race Condition vulnerability in Qualcomm products memory corruption in Kernel due to race condition while getting mapping reference in Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile | 7.0 |
| 2022-09-16 | CVE-2022-25656 | Integer Overflow or Wraparound vulnerability in Qualcomm products Possible integer overflow and memory corruption due to improper validation of buffer size sent to write to console when computing the payload size in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables | 7.8 |
| 2022-09-16 | CVE-2022-25669 | Out-of-bounds Read vulnerability in Qualcomm products Denial of service in video due to buffer over read while parsing MP4 clip in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 7.5 |
| 2022-09-16 | CVE-2022-25690 | Improper Validation of Array Index vulnerability in Qualcomm products Information disclosure in WLAN due to improper validation of array index while parsing crafted ANQP action frames in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music | 7.5 |
| 2022-09-16 | CVE-2022-25696 | Time-of-check Time-of-use (TOCTOU) Race Condition vulnerability in Qualcomm products Memory corruption in display due to time-of-check time-of-use race condition during map or unmap in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables | 7.0 |
| 2022-09-16 | CVE-2022-25706 | Out-of-bounds Read vulnerability in Qualcomm products Information disclosure in Bluetooth driver due to buffer over-read while reading l2cap length in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables | 7.5 |
| 2022-09-02 | CVE-2021-35122 | Improper Input Validation vulnerability in Qualcomm products Non-secure region can try modifying RG permissions of IO space xPUs due to improper input validation in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables | 7.8 |
| 2022-09-02 | CVE-2021-35132 | Improper Validation of Specified Quantity in Input vulnerability in Qualcomm products Out of bound write in DSP service due to improper bound check for response buffer size in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables | 7.8 |
| 2022-09-02 | CVE-2021-35134 | Incorrect Calculation of Buffer Size vulnerability in Qualcomm products Due to insufficient validation of ELF headers, an Incorrect Calculation of Buffer Size can occur in Boot leading to memory corruption in Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile | 8.4 |