Vulnerabilities > Qualcomm > Sm7315 Firmware > High
DATE | CVE | VULNERABILITY TITLE | RISK |
---|---|---|---|
2023-03-10 | CVE-2022-33242 | Improper Authentication vulnerability in Qualcomm products Memory corruption due to improper authentication in Qualcomm IPC while loading unsigned lib in audio PD. | 7.8 |
2023-03-10 | CVE-2022-33250 | Reachable Assertion vulnerability in Qualcomm products Transient DOS due to reachable assertion in modem when network repeatedly sent invalid message container for NR to LTE handover. | 7.5 |
2023-03-10 | CVE-2022-33257 | Time-of-check Time-of-use (TOCTOU) Race Condition vulnerability in Qualcomm products Memory corruption in Core due to time-of-check time-of-use race condition during dump collection in trust zone. | 7.0 |
2023-03-10 | CVE-2022-33278 | Classic Buffer Overflow vulnerability in Qualcomm products Memory corruption due to buffer copy without checking the size of input in HLOS when input message size is larger than the buffer capacity. | 7.8 |
2023-03-10 | CVE-2022-40527 | Reachable Assertion vulnerability in Qualcomm products Transient DOS due to reachable assertion in WLAN while processing PEER ID populated by TQM. | 7.5 |
2023-03-10 | CVE-2022-40530 | Integer Overflow or Wraparound vulnerability in Qualcomm products Memory corruption in WLAN due to integer overflow to buffer overflow in WLAN during initialization phase. | 7.8 |
2023-03-10 | CVE-2022-40531 | Incorrect Type Conversion or Cast vulnerability in Qualcomm products Memory corruption in WLAN due to incorrect type cast while sending WMI_SCAN_SCH_PRIO_TBL_CMDID message. | 7.8 |
2023-02-12 | CVE-2022-33232 | Classic Buffer Overflow vulnerability in Qualcomm products Memory corruption due to buffer copy without checking size of input while running memory sharing tests with large scattered memory. | 7.8 |
2023-02-12 | CVE-2022-33233 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption due to configuration weakness in modem wile sending command to write protected files. | 7.8 |
2023-02-12 | CVE-2022-33248 | Integer Overflow or Wraparound vulnerability in Qualcomm products Memory corruption in User Identity Module due to integer overflow to buffer overflow when a segement is received via qmi http. | 7.8 |