Vulnerabilities > Qualcomm > Sm7315 Firmware
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2023-09-05 | CVE-2023-28548 | Improper Validation of Array Index vulnerability in Qualcomm products Memory corruption in WLAN HAL while processing Tx/Rx commands from QDART. | 7.8 |
| 2023-09-05 | CVE-2023-28549 | Improper Restriction of Operations within the Bounds of a Memory Buffer vulnerability in Qualcomm products Memory corruption in WLAN HAL while parsing Rx buffer in processing TLV payload. | 7.8 |
| 2023-09-05 | CVE-2023-28557 | Improper Validation of Array Index vulnerability in Qualcomm products Memory corruption in WLAN HAL while processing command parameters from untrusted WMI payload. | 7.8 |
| 2023-09-05 | CVE-2023-28567 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in WLAN HAL while handling command through WMI interfaces. | 7.8 |
| 2023-09-05 | CVE-2023-28573 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in WLAN HAL while parsing WMI command parameters. | 7.8 |
| 2023-09-05 | CVE-2023-33015 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS in WLAN Firmware while interpreting MBSSID IE of a received beacon frame. | 7.5 |
| 2023-09-05 | CVE-2023-33021 | Use After Free vulnerability in Qualcomm products Memory corruption in Graphics while processing user packets for command submission. | 7.8 |
| 2023-08-08 | CVE-2023-21626 | Improper Authentication vulnerability in Qualcomm products Cryptographic issue in HLOS due to improper authentication while performing key velocity checks using more than one key. | 7.1 |
| 2023-08-08 | CVE-2023-21651 | Incorrect Type Conversion or Cast vulnerability in Qualcomm products Memory Corruption in Core due to incorrect type conversion or cast in secure_io_read/write function in TEE. | 7.8 |
| 2023-08-08 | CVE-2023-21652 | Use of Hard-coded Credentials vulnerability in Qualcomm products Cryptographic issue in HLOS as derived keys used to encrypt/decrypt information is present on stack after use. | 7.1 |