Vulnerabilities > Qualcomm > Sm7250P Firmware > High
DATE | CVE | VULNERABILITY TITLE | RISK |
---|---|---|---|
2023-10-03 | CVE-2023-24850 | Improper Validation of Array Index vulnerability in Qualcomm products Memory Corruption in HLOS while importing a cryptographic key into KeyMaster Trusted Application. | 7.8 |
2023-10-03 | CVE-2023-24853 | Out-of-bounds Write vulnerability in Qualcomm products Memory Corruption in HLOS while registering for key provisioning notify. | 7.8 |
2023-10-03 | CVE-2023-28540 | Improper Authentication vulnerability in Qualcomm products Cryptographic issue in Data Modem due to improper authentication during TLS handshake. | 7.5 |
2023-10-03 | CVE-2023-33027 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS in WLAN Firmware while parsing rsn ies. | 7.5 |
2023-10-03 | CVE-2023-33035 | Classic Buffer Overflow vulnerability in Qualcomm products Memory corruption while invoking callback function of AFE from ADSP. | 7.8 |
2023-09-05 | CVE-2022-33275 | Improper Validation of Array Index vulnerability in Qualcomm products Memory corruption due to improper validation of array index in WLAN HAL when received lm_itemNum is out of range. | 7.8 |
2023-09-05 | CVE-2023-21646 | Reachable Assertion vulnerability in Qualcomm products Transient DOS in Modem while processing invalid System Information Block 1. | 7.5 |
2023-09-05 | CVE-2023-21662 | Classic Buffer Overflow vulnerability in Qualcomm products Memory corruption in Core Platform while printing the response buffer in log. | 7.8 |
2023-09-05 | CVE-2023-21664 | Out-of-bounds Write vulnerability in Qualcomm products Memory Corruption in Core Platform while printing the response buffer in log. | 7.8 |
2023-09-05 | CVE-2023-28538 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in WIN Product while invoking WinAcpi update driver in the UEFI region. | 7.8 |