Vulnerabilities > Qualcomm > Sm7250P Firmware > High
DATE | CVE | VULNERABILITY TITLE | RISK |
---|---|---|---|
2022-01-03 | CVE-2021-30276 | Unspecified vulnerability in Qualcomm products Improper access control while doing XPU re-configuration dynamically can lead to unauthorized access to a secure resource in Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Wired Infrastructure and Networking | 7.2 |
2022-01-03 | CVE-2021-30279 | Improper Preservation of Permissions vulnerability in Qualcomm products Possible access control violation while setting current permission for VMIDs due to improper permission masking in Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wired Infrastructure and Networking | 7.2 |
2022-01-03 | CVE-2021-30282 | Improper Validation of Array Index vulnerability in Qualcomm products Possible out of bound write in RAM partition table due to improper validation on number of partitions provided in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking | 7.2 |
2022-01-03 | CVE-2021-30303 | Classic Buffer Overflow vulnerability in Qualcomm products Possible buffer overflow due to lack of buffer length check when segmented WMI command is received in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking | 7.2 |
2022-01-03 | CVE-2021-30336 | Out-of-bounds Read vulnerability in Qualcomm products Possible out of bound read due to lack of domain input validation while processing APK close session request in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Wearables | 7.2 |
2022-01-03 | CVE-2021-30337 | Use After Free vulnerability in Qualcomm products Possible use after free when process shell memory is freed using IOCTL call and process initialization is in progress in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking | 7.2 |
2022-01-03 | CVE-2021-30351 | Classic Buffer Overflow vulnerability in Qualcomm products An out of bound memory access can occur due to improper validation of number of frames being passed during music playback in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking | 7.5 |
2021-07-13 | CVE-2021-1886 | Out-of-bounds Write vulnerability in Qualcomm products Incorrect handling of pointers in trusted application key import mechanism could cause memory corruption in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Voice & Music, Snapdragon Wearables | 7.2 |
2021-07-13 | CVE-2021-1888 | Double Free vulnerability in Qualcomm products Memory corruption in key parsing and import function due to double freeing the same heap allocation in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Voice & Music, Snapdragon Wearables | 7.2 |
2021-07-13 | CVE-2021-1889 | Classic Buffer Overflow vulnerability in Qualcomm products Possible buffer overflow due to lack of length check in Trusted Application in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Voice & Music, Snapdragon Wearables | 7.2 |