Vulnerabilities > Qualcomm > Sm7250P Firmware > High
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2022-06-14 | CVE-2021-30347 | Time-of-check Time-of-use (TOCTOU) Race Condition vulnerability in Qualcomm products Improper integrity check can lead to race condition between tasks PDCP and RRC? right after a valid RRC Command packet has been received in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile | 8.1 |
| 2022-06-14 | CVE-2021-30350 | Improper Validation of Specified Quantity in Input vulnerability in Qualcomm products Lack of MBN header size verification against input buffer can lead to memory corruption in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Wearables | 7.8 |
| 2022-06-14 | CVE-2021-35073 | Reachable Assertion vulnerability in Qualcomm products Possible assertion due to improper validation of rank restriction field in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile | 7.5 |
| 2022-06-14 | CVE-2021-35076 | NULL Pointer Dereference vulnerability in Qualcomm products Possible null pointer dereference due to improper validation of RRC connection reconfiguration message in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile | 7.5 |
| 2022-06-14 | CVE-2021-35078 | Memory Leak vulnerability in Qualcomm products Possible memory leak due to improper validation of certificate chain length while parsing server certificate chain in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables | 7.5 |
| 2022-06-14 | CVE-2021-35084 | Out-of-bounds Read vulnerability in Qualcomm products Possible out of bound read due to lack of length check of data length for a DIAG event in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music | 7.1 |
| 2022-06-14 | CVE-2021-35085 | Out-of-bounds Read vulnerability in Qualcomm products Possible buffer overflow due to lack of buffer length check during management frame Rx handling in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile | 7.1 |
| 2022-06-14 | CVE-2021-35086 | Out-of-bounds Read vulnerability in Qualcomm products Possible buffer over read due to improper validation of SIB type when processing a NR system Information message in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile | 7.5 |
| 2022-06-14 | CVE-2021-35087 | NULL Pointer Dereference vulnerability in Qualcomm products Possible null pointer access due to improper validation of system information message to be processed in Snapdragon Industrial IOT, Snapdragon Mobile | 7.5 |
| 2022-06-14 | CVE-2021-35090 | Time-of-check Time-of-use (TOCTOU) Race Condition vulnerability in Qualcomm products Possible hypervisor memory corruption due to TOC TOU race condition when updating address mappings in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile | 7.8 |