Vulnerabilities > Qualcomm > Sm7250P Firmware > Critical
DATE | CVE | VULNERABILITY TITLE | RISK |
---|---|---|---|
2022-04-01 | CVE-2021-35117 | Out-of-bounds Read vulnerability in Qualcomm products An Out of Bounds read may potentially occur while processing an IBSS beacon, in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music | 9.1 |
2022-04-01 | CVE-2021-35088 | Out-of-bounds Read vulnerability in Qualcomm products Possible out of bound read due to improper validation of IE length during SSID IE parse when channel is DFS in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking | 9.1 |
2022-02-11 | CVE-2021-35068 | NULL Pointer Dereference vulnerability in Qualcomm products Lack of null check while freeing the device information buffer in the Bluetooth HFP protocol can lead to a NULL pointer dereference in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Voice & Music, Snapdragon Wearables | 9.8 |
2022-01-03 | CVE-2021-30351 | Classic Buffer Overflow vulnerability in Qualcomm products An out of bound memory access can occur due to improper validation of number of frames being passed during music playback in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking | 9.8 |
2021-07-13 | CVE-2020-11307 | Improper Validation of Array Index vulnerability in Qualcomm products Buffer overflow in modem due to improper array index check before copying into it in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Wearables | 9.8 |
2021-06-09 | CVE-2020-11291 | Improper Validation of Array Index vulnerability in Qualcomm products Possible buffer overflow while updating ikev2 parameters for delete payloads received during informational exchange due to lack of check of input validation for certain parameters received from the ePDG server in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile | 9.8 |
2021-06-09 | CVE-2020-11176 | Out-of-bounds Write vulnerability in Qualcomm products While processing server certificate from IPSec server, certificate validation for subject alternative name API can cause heap overflow which can lead to memory corruption in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile | 9.8 |
2021-06-09 | CVE-2020-11182 | Out-of-bounds Write vulnerability in Qualcomm products Possible heap overflow while parsing NAL header due to lack of check of length of data received from user in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile | 9.8 |
2021-06-09 | CVE-2020-11159 | Out-of-bounds Read vulnerability in Qualcomm products Buffer over-read can happen while processing WPA,RSN IE of beacon and response frames if IE length is less than length of frame pointer being accessed in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking | 9.1 |
2021-06-09 | CVE-2020-11134 | Improper Validation of Array Index vulnerability in Qualcomm products Possible stack out of bound write might happen due to time bitmap length and bit duration fields of the attributes like NAN ranging setup attribute inside a NAN management frame are not Properly validated in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking | 9.8 |