Vulnerabilities > Qualcomm > Sm7250P Firmware
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2024-01-02 | CVE-2023-33037 | Missing Encryption of Sensitive Data vulnerability in Qualcomm products Cryptographic issue in Automotive while unwrapping the key secs2d and verifying with RPMB data. | 5.5 |
| 2024-01-02 | CVE-2023-33038 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption while receiving a message in Bus Socket Transport Server. | 7.8 |
| 2024-01-02 | CVE-2023-33040 | Unspecified vulnerability in Qualcomm products Transient DOS in Data Modem during DTLS handshake. | 7.5 |
| 2024-01-02 | CVE-2023-33062 | Unspecified vulnerability in Qualcomm products Transient DOS in WLAN Firmware while parsing a BTM request. | 7.5 |
| 2024-01-02 | CVE-2023-33094 | Use After Free vulnerability in Qualcomm products Memory corruption while running VK synchronization with KASAN enabled. | 7.8 |
| 2024-01-02 | CVE-2023-33109 | NULL Pointer Dereference vulnerability in Qualcomm products Transient DOS while processing a WMI P2P listen start command (0xD00A) sent from host. | 7.5 |
| 2024-01-02 | CVE-2023-33114 | Use After Free vulnerability in Qualcomm products Memory corruption while running NPU, when NETWORK_UNLOAD and (NETWORK_UNLOAD or NETWORK_EXECUTE_V2) commands are submitted at the same time. | 7.8 |
| 2024-01-02 | CVE-2023-33117 | Use After Free vulnerability in Qualcomm products Memory corruption when HLOS allocates the response payload buffer to copy the data received from ADSP in response to AVCS_LOAD_MODULE command. | 7.8 |
| 2024-01-02 | CVE-2023-33118 | Use After Free vulnerability in Qualcomm products Memory corruption while processing Listen Sound Model client payload buffer when there is a request for Listen Sound session get parameter from ST HAL. | 7.8 |
| 2024-01-02 | CVE-2023-33120 | Use After Free vulnerability in Qualcomm products Memory corruption in Audio when memory map command is executed consecutively in ADSP. | 7.8 |