Vulnerabilities > Qualcomm > Sm7250P Firmware
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2024-09-02 | CVE-2024-33043 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS while handling PS event when Program Service name length offset value is set to 255. | 5.5 |
| 2024-09-02 | CVE-2024-33051 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS while processing TIM IE from beacon frame as there is no check for IE length. | 7.5 |
| 2024-09-02 | CVE-2024-33052 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption when user provides data for FM HCI command control operations. | 7.8 |
| 2024-09-02 | CVE-2024-33060 | Use After Free vulnerability in Qualcomm products Memory corruption when two threads try to map and unmap a single node simultaneously. | 7.8 |
| 2024-08-05 | CVE-2024-23355 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption when keymaster operation imports a shared key. | 7.8 |
| 2024-08-05 | CVE-2024-23357 | NULL Pointer Dereference vulnerability in Qualcomm products Transient DOS while importing a PKCS#8-encoded RSA key with zero bytes modulus. | 5.5 |
| 2024-07-01 | CVE-2024-21461 | Double Free vulnerability in Qualcomm products Memory corruption while performing finish HMAC operation when context is freed by keymaster. | 7.8 |
| 2024-07-01 | CVE-2024-21462 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS while loading the TA ELF file. | 5.5 |
| 2024-07-01 | CVE-2024-21465 | Out-of-bounds Read vulnerability in Qualcomm products Memory corruption while processing key blob passed by the user. | 7.8 |
| 2024-07-01 | CVE-2024-21469 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption when an invoke call and a TEE call are bound for the same trusted application. | 7.8 |