Vulnerabilities > Qualcomm > Sm7250 AC Firmware
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2023-10-03 | CVE-2023-28540 | Improper Authentication vulnerability in Qualcomm products Cryptographic issue in Data Modem due to improper authentication during TLS handshake. | 7.5 |
| 2023-10-03 | CVE-2023-33027 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS in WLAN Firmware while parsing rsn ies. | 7.5 |
| 2023-10-03 | CVE-2023-33035 | Classic Buffer Overflow vulnerability in Qualcomm products Memory corruption while invoking callback function of AFE from ADSP. | 7.8 |
| 2023-09-05 | CVE-2022-33275 | Improper Validation of Array Index vulnerability in Qualcomm products Memory corruption due to improper validation of array index in WLAN HAL when received lm_itemNum is out of range. | 7.8 |
| 2023-09-05 | CVE-2023-28560 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in WLAN HAL while processing devIndex from untrusted WMI payload. | 7.8 |
| 2023-06-06 | CVE-2022-22060 | Reachable Assertion vulnerability in Qualcomm products Assertion occurs while processing Reconfiguration message due to improper validation | 7.5 |
| 2023-06-06 | CVE-2022-22076 | Unspecified vulnerability in Qualcomm products information disclosure due to cryptographic issue in Core during RPMB read request. | 5.5 |
| 2023-06-06 | CVE-2022-33251 | Reachable Assertion vulnerability in Qualcomm products Transient DOS due to reachable assertion in Modem because of invalid network configuration. | 7.5 |
| 2023-06-06 | CVE-2022-33264 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in modem due to stack based buffer overflow while parsing OTASP Key Generation Request Message. | 7.8 |
| 2023-06-06 | CVE-2022-33307 | Double Free vulnerability in Qualcomm products Memory Corruption due to double free in automotive when a bad HLOS address for one of the lists to be mapped is passed. | 7.8 |