Vulnerabilities > Qualcomm > Sm6370 Firmware > High
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2024-11-04 | CVE-2024-38415 | Use After Free vulnerability in Qualcomm products Memory corruption while handling session errors from firmware. | 7.8 |
| 2024-11-04 | CVE-2024-38422 | Unspecified vulnerability in Qualcomm products Memory corruption while processing voice packet with arbitrary data received from ADSP. | 7.8 |
| 2024-11-04 | CVE-2024-38423 | Classic Buffer Overflow vulnerability in Qualcomm products Memory corruption while processing GPU page table switch. | 7.8 |
| 2024-09-02 | CVE-2024-33045 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption when BTFM client sends new messages over Slimbus to ADSP. | 7.8 |
| 2024-09-02 | CVE-2024-33050 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS while parsing MBSSID during new IE generation in beacon/probe frame when IE length check is either missing or improper. | 7.5 |
| 2024-09-02 | CVE-2024-33051 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS while processing TIM IE from beacon frame as there is no check for IE length. | 7.5 |
| 2024-09-02 | CVE-2024-33060 | Use After Free vulnerability in Qualcomm products Memory corruption when two threads try to map and unmap a single node simultaneously. | 7.8 |
| 2024-09-02 | CVE-2024-38402 | Use After Free vulnerability in Qualcomm products Memory corruption while processing IOCTL call for getting group info. | 7.8 |
| 2024-08-05 | CVE-2024-33023 | Use After Free vulnerability in Qualcomm products Memory corruption while creating a fence to wait on timeline events, and simultaneously signal timeline events. | 7.8 |
| 2024-07-01 | CVE-2024-21461 | Double Free vulnerability in Qualcomm products Memory corruption while performing finish HMAC operation when context is freed by keymaster. | 7.8 |