Vulnerabilities > Qualcomm > Sm6250P Firmware > High
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2021-10-20 | CVE-2021-1959 | Out-of-bounds Write vulnerability in Qualcomm products Possible memory corruption due to lack of bound check of input index in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 7.2 |
| 2021-10-20 | CVE-2021-1983 | Classic Buffer Overflow vulnerability in Qualcomm products Possible buffer overflow due to improper handling of negative data length while processing write request in VR service in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Wearables | 7.2 |
| 2021-10-20 | CVE-2021-1984 | Classic Buffer Overflow vulnerability in Qualcomm products Possible buffer overflow due to improper validation of index value while processing the plugin block in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Wearables | 7.2 |
| 2021-10-20 | CVE-2021-30258 | Out-of-bounds Write vulnerability in Qualcomm products Possible buffer overflow due to improper size calculation of payload received in VR service in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Wearables | 7.2 |
| 2021-10-20 | CVE-2021-30288 | Out-of-bounds Write vulnerability in Qualcomm products Possible stack overflow due to improper length check of TLV while copying the TLV to a local stack variable in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking | 7.2 |
| 2021-10-20 | CVE-2021-30291 | Out-of-bounds Write vulnerability in Qualcomm products Possible memory corruption due to lack of validation of client data used for memory allocation in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Wearables | 7.2 |
| 2021-10-20 | CVE-2021-30292 | Out-of-bounds Write vulnerability in Qualcomm products Possible memory corruption due to lack of validation of client data used for memory allocation in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Wearables | 7.2 |
| 2021-09-17 | CVE-2021-30261 | Improper Input Validation vulnerability in Qualcomm products Possible integer and heap overflow due to lack of input command size validation while handling beacon template update command from HLOS in Snapdragon Auto, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 7.2 |
| 2021-09-09 | CVE-2021-1909 | Classic Buffer Overflow vulnerability in Qualcomm products Buffer overflow occurs in trusted applications due to lack of length check of parameters in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking | 7.2 |
| 2021-09-09 | CVE-2021-1934 | Double Free vulnerability in Qualcomm products Possible memory corruption due to improper check when application loader object is explicitly destructed while application is unloading in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT | 7.2 |