Vulnerabilities > Qualcomm > Sm6250P Firmware

DATE CVE VULNERABILITY TITLE RISK
2023-01-09 CVE-2022-33286 Out-of-bounds Read vulnerability in Qualcomm products
Transient DOS due to buffer over-read in WLAN while processing 802.11 management frames.
low complexity
qualcomm CWE-125
6.5
2023-01-09 CVE-2022-40516 Out-of-bounds Write vulnerability in Qualcomm products
Memory corruption in Core due to stack-based buffer overflow.
local
low complexity
qualcomm CWE-787
7.8
2023-01-09 CVE-2022-40517 Out-of-bounds Write vulnerability in Qualcomm products
Memory corruption in core due to stack-based buffer overflow
local
low complexity
qualcomm CWE-787
7.8
2023-01-09 CVE-2022-40518 Out-of-bounds Read vulnerability in Qualcomm products
Information disclosure due to buffer overread in Core
local
low complexity
qualcomm CWE-125
5.5
2023-01-09 CVE-2022-40519 Out-of-bounds Read vulnerability in Qualcomm products
Information disclosure due to buffer overread in Core
local
low complexity
qualcomm CWE-125
5.5
2023-01-09 CVE-2022-40520 Out-of-bounds Write vulnerability in Qualcomm products
Memory corruption due to stack-based buffer overflow in Core
local
low complexity
qualcomm CWE-787
7.8
2022-12-13 CVE-2022-25682 Improper Restriction of Operations within the Bounds of a Memory Buffer vulnerability in Qualcomm products
Memory corruption in MODEM UIM due to usage of out of range pointer offset while decoding command from card in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables
local
low complexity
qualcomm CWE-119
7.8
2022-12-13 CVE-2022-25685 Unspecified vulnerability in Qualcomm products
Denial of service in Modem module due to improper authorization while error handling in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables
network
low complexity
qualcomm
7.5
2022-12-13 CVE-2022-25695 Improper Validation of Array Index vulnerability in Qualcomm products
Memory corruption in MODEM due to Improper Validation of Array Index while processing GSTK Proactive commands in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables
local
low complexity
qualcomm CWE-129
7.8
2022-12-13 CVE-2022-33235 Out-of-bounds Read vulnerability in Qualcomm products
Information disclosure due to buffer over-read in WLAN firmware while parsing security context info attributes.
network
low complexity
qualcomm CWE-125
7.5