Vulnerabilities > Qualcomm > Sm6250P Firmware
DATE | CVE | VULNERABILITY TITLE | RISK |
---|---|---|---|
2023-01-09 | CVE-2022-22088 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in Bluetooth HOST due to buffer overflow while parsing the command response received from remote | 8.8 |
2023-01-09 | CVE-2022-33284 | Out-of-bounds Read vulnerability in Qualcomm products Information disclosure due to buffer over-read in WLAN while parsing BTM action frame. | 6.5 |
2023-01-09 | CVE-2022-33285 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS due to buffer over-read in WLAN while parsing WLAN CSA action frames. | 6.5 |
2023-01-09 | CVE-2022-33286 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS due to buffer over-read in WLAN while processing 802.11 management frames. | 6.5 |
2023-01-09 | CVE-2022-40516 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in Core due to stack-based buffer overflow. | 7.8 |
2023-01-09 | CVE-2022-40517 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in core due to stack-based buffer overflow | 7.8 |
2023-01-09 | CVE-2022-40518 | Out-of-bounds Read vulnerability in Qualcomm products Information disclosure due to buffer overread in Core | 5.5 |
2023-01-09 | CVE-2022-40519 | Out-of-bounds Read vulnerability in Qualcomm products Information disclosure due to buffer overread in Core | 5.5 |
2023-01-09 | CVE-2022-40520 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption due to stack-based buffer overflow in Core | 7.8 |
2022-12-13 | CVE-2022-25682 | Improper Restriction of Operations within the Bounds of a Memory Buffer vulnerability in Qualcomm products Memory corruption in MODEM UIM due to usage of out of range pointer offset while decoding command from card in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 7.8 |