Vulnerabilities > Qualcomm > Sm6250 Firmware > High

DATE CVE VULNERABILITY TITLE RISK
2023-02-12 CVE-2022-33233 Out-of-bounds Write vulnerability in Qualcomm products
Memory corruption due to configuration weakness in modem wile sending command to write protected files.
local
low complexity
qualcomm CWE-787
7.8
2023-02-12 CVE-2022-33248 Integer Overflow or Wraparound vulnerability in Qualcomm products
Memory corruption in User Identity Module due to integer overflow to buffer overflow when a segement is received via qmi http.
local
low complexity
qualcomm CWE-190
7.8
2023-02-12 CVE-2022-33271 Out-of-bounds Read vulnerability in Qualcomm products
Information disclosure due to buffer over-read in WLAN while parsing NMF frame.
network
low complexity
qualcomm CWE-125
7.5
2023-02-12 CVE-2022-33277 Classic Buffer Overflow vulnerability in Qualcomm products
Memory corruption in modem due to buffer copy without checking size of input while receiving WMI command.
local
low complexity
qualcomm CWE-120
7.8
2023-02-12 CVE-2022-40512 Out-of-bounds Read vulnerability in Qualcomm products
Transient DOS in WLAN Firmware due to buffer over-read while processing probe response or beacon.
network
low complexity
qualcomm CWE-125
7.5
2023-01-09 CVE-2022-22088 Out-of-bounds Write vulnerability in Qualcomm products
Memory corruption in Bluetooth HOST due to buffer overflow while parsing the command response received from remote
low complexity
qualcomm CWE-787
8.8
2023-01-09 CVE-2022-40516 Out-of-bounds Write vulnerability in Qualcomm products
Memory corruption in Core due to stack-based buffer overflow.
local
low complexity
qualcomm CWE-787
7.8
2023-01-09 CVE-2022-40517 Out-of-bounds Write vulnerability in Qualcomm products
Memory corruption in core due to stack-based buffer overflow
local
low complexity
qualcomm CWE-787
7.8
2023-01-09 CVE-2022-40520 Out-of-bounds Write vulnerability in Qualcomm products
Memory corruption due to stack-based buffer overflow in Core
local
low complexity
qualcomm CWE-787
7.8
2022-12-13 CVE-2022-25677 Use After Free vulnerability in Qualcomm products
Memory corruption in diag due to use after free while processing dci packet in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking
local
low complexity
qualcomm CWE-416
7.8