Vulnerabilities > Qualcomm > Sm6250 Firmware > High
DATE | CVE | VULNERABILITY TITLE | RISK |
---|---|---|---|
2023-02-12 | CVE-2022-33233 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption due to configuration weakness in modem wile sending command to write protected files. | 7.8 |
2023-02-12 | CVE-2022-33248 | Integer Overflow or Wraparound vulnerability in Qualcomm products Memory corruption in User Identity Module due to integer overflow to buffer overflow when a segement is received via qmi http. | 7.8 |
2023-02-12 | CVE-2022-33271 | Out-of-bounds Read vulnerability in Qualcomm products Information disclosure due to buffer over-read in WLAN while parsing NMF frame. | 7.5 |
2023-02-12 | CVE-2022-33277 | Classic Buffer Overflow vulnerability in Qualcomm products Memory corruption in modem due to buffer copy without checking size of input while receiving WMI command. | 7.8 |
2023-02-12 | CVE-2022-40512 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS in WLAN Firmware due to buffer over-read while processing probe response or beacon. | 7.5 |
2023-01-09 | CVE-2022-22088 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in Bluetooth HOST due to buffer overflow while parsing the command response received from remote | 8.8 |
2023-01-09 | CVE-2022-40516 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in Core due to stack-based buffer overflow. | 7.8 |
2023-01-09 | CVE-2022-40517 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in core due to stack-based buffer overflow | 7.8 |
2023-01-09 | CVE-2022-40520 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption due to stack-based buffer overflow in Core | 7.8 |
2022-12-13 | CVE-2022-25677 | Use After Free vulnerability in Qualcomm products Memory corruption in diag due to use after free while processing dci packet in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking | 7.8 |