Vulnerabilities > Qualcomm > Sm6225 AD Firmware > High
DATE | CVE | VULNERABILITY TITLE | RISK |
---|---|---|---|
2023-10-03 | CVE-2023-24850 | Improper Validation of Array Index vulnerability in Qualcomm products Memory Corruption in HLOS while importing a cryptographic key into KeyMaster Trusted Application. | 7.8 |
2023-10-03 | CVE-2023-28540 | Improper Authentication vulnerability in Qualcomm products Cryptographic issue in Data Modem due to improper authentication during TLS handshake. | 7.5 |
2023-10-03 | CVE-2023-33027 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS in WLAN Firmware while parsing rsn ies. | 7.5 |
2023-10-03 | CVE-2023-33029 | Use After Free vulnerability in Qualcomm products Memory corruption in DSP Service during a remote call from HLOS to DSP. | 7.8 |
2023-10-03 | CVE-2023-33035 | Classic Buffer Overflow vulnerability in Qualcomm products Memory corruption while invoking callback function of AFE from ADSP. | 7.8 |
2023-09-05 | CVE-2022-33275 | Improper Validation of Array Index vulnerability in Qualcomm products Memory corruption due to improper validation of array index in WLAN HAL when received lm_itemNum is out of range. | 7.8 |
2023-09-05 | CVE-2023-28560 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in WLAN HAL while processing devIndex from untrusted WMI payload. | 7.8 |
2023-08-08 | CVE-2023-28555 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS in Audio while remapping channel buffer in media codec decoding. | 7.5 |
2023-06-06 | CVE-2022-33264 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in modem due to stack based buffer overflow while parsing OTASP Key Generation Request Message. | 7.8 |
2023-06-06 | CVE-2022-40507 | Double Free vulnerability in Qualcomm products Memory corruption due to double free in Core while mapping HLOS address to the list. | 7.8 |