Vulnerabilities > Qualcomm > Sm6150 AC Firmware > High
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2024-07-01 | CVE-2024-21461 | Double Free vulnerability in Qualcomm products Memory corruption while performing finish HMAC operation when context is freed by keymaster. | 7.8 |
| 2024-07-01 | CVE-2024-21465 | Out-of-bounds Read vulnerability in Qualcomm products Memory corruption while processing key blob passed by the user. | 7.8 |
| 2024-07-01 | CVE-2024-21469 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption when an invoke call and a TEE call are bound for the same trusted application. | 7.8 |
| 2024-07-01 | CVE-2024-23373 | Use After Free vulnerability in Qualcomm products Memory corruption when IOMMU unmap operation fails, the DMA and anon buffers are getting released. | 7.8 |
| 2023-12-05 | CVE-2023-33017 | Classic Buffer Overflow vulnerability in Qualcomm products Memory corruption in Boot while running a ListVars test in UEFI Menu during boot. | 7.8 |
| 2023-12-05 | CVE-2023-33018 | Integer Overflow or Wraparound vulnerability in Qualcomm products Memory corruption while using the UIM diag command to get the operators name. | 7.8 |
| 2023-12-05 | CVE-2023-33022 | Integer Overflow or Wraparound vulnerability in Qualcomm products Memory corruption in HLOS while invoking IOCTL calls from user-space. | 7.8 |
| 2023-12-05 | CVE-2023-33063 | Use After Free vulnerability in Qualcomm products Memory corruption in DSP Services during a remote call from HLOS to DSP. | 7.8 |
| 2023-12-05 | CVE-2023-33080 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS while parsing a vender specific IE (Information Element) of reassociation response management frame. | 7.5 |
| 2023-11-07 | CVE-2023-33059 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in Audio while processing the VOC packet data from ADSP. | 7.8 |