Vulnerabilities > Qualcomm > Sg8275P Firmware > High
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2024-07-01 | CVE-2024-23373 | Use After Free vulnerability in Qualcomm products Memory corruption when IOMMU unmap operation fails, the DMA and anon buffers are getting released. | 7.8 |
| 2024-02-06 | CVE-2023-33072 | Classic Buffer Overflow vulnerability in Qualcomm products Memory corruption in Core while processing control functions. | 7.8 |
| 2024-02-06 | CVE-2023-33076 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in Core when updating rollback version for TA and OTA feature is enabled. | 7.8 |
| 2024-02-06 | CVE-2023-43513 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption while processing the event ring, the context read pointer is untrusted to HLOS and when it is passed with arbitrary values, may point to address in the middle of ring element. | 7.8 |
| 2024-02-06 | CVE-2023-43522 | NULL Pointer Dereference vulnerability in Qualcomm products Transient DOS while key unwrapping process, when the given encrypted key is empty or NULL. | 7.5 |
| 2024-02-06 | CVE-2023-43523 | Reachable Assertion vulnerability in Qualcomm products Transient DOS while processing 11AZ RTT management action frame received through OTA. | 7.5 |
| 2024-02-06 | CVE-2023-43536 | Unspecified vulnerability in Qualcomm products Transient DOS while parse fils IE with length equal to 1. | 7.5 |
| 2024-02-06 | CVE-2023-33046 | Time-of-check Time-of-use (TOCTOU) Race Condition vulnerability in Qualcomm products Memory corruption in Trusted Execution Environment while deinitializing an object used for license validation. | 7.0 |
| 2024-02-06 | CVE-2023-33049 | Memory Leak vulnerability in Qualcomm products Transient DOS in Multi-Mode Call Processor due to UE failure because of heap leakage. | 7.5 |
| 2024-02-06 | CVE-2023-33057 | Improper Input Validation vulnerability in Qualcomm products Transient DOS in Multi-Mode Call Processor while processing UE policy container. | 7.5 |