Vulnerabilities > Qualcomm > Sg8275P Firmware
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2024-10-07 | CVE-2024-38397 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS while parsing probe response and assoc response frame. | 7.5 |
| 2024-09-02 | CVE-2024-33038 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption while passing untrusted/corrupted pointers from DSP to EVA. | 7.8 |
| 2024-09-02 | CVE-2024-33045 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption when BTFM client sends new messages over Slimbus to ADSP. | 7.8 |
| 2024-09-02 | CVE-2024-33048 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS while parsing the received TID-to-link mapping element of beacon/probe response frame. | 7.5 |
| 2024-09-02 | CVE-2024-33050 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS while parsing MBSSID during new IE generation in beacon/probe frame when IE length check is either missing or improper. | 7.5 |
| 2024-09-02 | CVE-2024-33054 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption during the handshake between the Primary Virtual Machine and Trusted Virtual Machine. | 7.8 |
| 2024-09-02 | CVE-2024-33057 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS while parsing the multi-link element Control field when common information length check is missing before updating the location. | 7.5 |
| 2024-09-02 | CVE-2024-33060 | Use After Free vulnerability in Qualcomm products Memory corruption when two threads try to map and unmap a single node simultaneously. | 7.8 |
| 2024-09-02 | CVE-2024-38402 | Use After Free vulnerability in Qualcomm products Memory corruption while processing IOCTL call for getting group info. | 7.8 |
| 2024-08-05 | CVE-2024-33014 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS while parsing ESP IE from beacon/probe response frame. | 7.5 |