Vulnerabilities > Qualcomm > Sg8275P Firmware
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2023-10-03 | CVE-2023-24848 | Unspecified vulnerability in Qualcomm products Information Disclosure in Data Modem while performing a VoLTE call with an undefined RTCP FB line value. | 7.5 |
| 2023-10-03 | CVE-2023-24849 | Unspecified vulnerability in Qualcomm products Information Disclosure in data Modem while parsing an FMTP line in an SDP message. | 7.5 |
| 2023-10-03 | CVE-2023-24850 | Improper Validation of Array Index vulnerability in Qualcomm products Memory Corruption in HLOS while importing a cryptographic key into KeyMaster Trusted Application. | 7.8 |
| 2023-10-03 | CVE-2023-24853 | Out-of-bounds Write vulnerability in Qualcomm products Memory Corruption in HLOS while registering for key provisioning notify. | 7.8 |
| 2023-10-03 | CVE-2023-24855 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in Modem while processing security related configuration before AS Security Exchange. | 9.8 |
| 2023-10-03 | CVE-2023-28540 | Improper Authentication vulnerability in Qualcomm products Cryptographic issue in Data Modem due to improper authentication during TLS handshake. | 7.5 |
| 2023-10-03 | CVE-2023-33026 | Resource Exhaustion vulnerability in Qualcomm products Transient DOS in WLAN Firmware while parsing a NAN management frame. | 7.5 |
| 2023-10-03 | CVE-2023-33027 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS in WLAN Firmware while parsing rsn ies. | 7.5 |
| 2023-10-03 | CVE-2023-33028 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in WLAN Firmware while doing a memory copy of pmk cache. | 9.8 |
| 2023-10-03 | CVE-2023-33029 | Use After Free vulnerability in Qualcomm products Memory corruption in DSP Service during a remote call from HLOS to DSP. | 7.8 |