Vulnerabilities > Qualcomm > Sg8275P Firmware
DATE | CVE | VULNERABILITY TITLE | RISK |
---|---|---|---|
2025-03-03 | CVE-2024-43051 | Improper Authorization vulnerability in Qualcomm products Information disclosure while deriving keys for a session for any Widevine use case. | 5.5 |
2025-03-03 | CVE-2024-43056 | Buffer Over-read vulnerability in Qualcomm products Transient DOS during hypervisor virtual I/O operation in a virtual machine. | 6.5 |
2025-03-03 | CVE-2024-53014 | Improper Validation of Array Index vulnerability in Qualcomm products Memory corruption may occur while validating ports and channels in Audio driver. | 7.8 |
2025-03-03 | CVE-2024-53024 | NULL Pointer Dereference vulnerability in Qualcomm products Memory corruption in display driver while detaching a device. | 7.8 |
2025-03-03 | CVE-2024-53027 | Classic Buffer Overflow vulnerability in Qualcomm products Transient DOS may occur while processing the country IE. | 7.5 |
2025-03-03 | CVE-2025-21424 | Use After Free vulnerability in Qualcomm products Memory corruption while calling the NPU driver APIs concurrently. | 7.8 |
2025-02-03 | CVE-2024-38411 | Use After Free vulnerability in Qualcomm products Memory corruption while registering a buffer from user-space to kernel-space using IOCTL calls. | 7.8 |
2025-02-03 | CVE-2024-49833 | Improper Validation of Array Index vulnerability in Qualcomm products Memory corruption can occur in the camera when an invalid CID is used. | 7.8 |
2025-02-03 | CVE-2024-49834 | Improper Validation of Array Index vulnerability in Qualcomm products Memory corruption while power-up or power-down sequence of the camera sensor. | 7.8 |
2025-02-03 | CVE-2024-49839 | Out-of-bounds Read vulnerability in Qualcomm products Memory corruption during management frame processing due to mismatch in T2LM info element. | 9.8 |