Vulnerabilities > Qualcomm > Sdx57M Firmware
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2023-09-05 | CVE-2023-21662 | Classic Buffer Overflow vulnerability in Qualcomm products Memory corruption in Core Platform while printing the response buffer in log. | 7.8 |
| 2023-09-05 | CVE-2023-21664 | Out-of-bounds Write vulnerability in Qualcomm products Memory Corruption in Core Platform while printing the response buffer in log. | 7.8 |
| 2023-08-08 | CVE-2023-21651 | Incorrect Type Conversion or Cast vulnerability in Qualcomm products Memory Corruption in Core due to incorrect type conversion or cast in secure_io_read/write function in TEE. | 7.8 |
| 2023-07-04 | CVE-2023-21629 | Double Free vulnerability in Qualcomm products Memory Corruption in Modem due to double free while parsing the PKCS15 sim files. | 6.8 |
| 2023-07-04 | CVE-2023-21631 | Unspecified vulnerability in Qualcomm products Weak Configuration due to improper input validation in Modem while processing LTE security mode command message received from network. | 9.8 |
| 2023-06-06 | CVE-2022-22060 | Reachable Assertion vulnerability in Qualcomm products Assertion occurs while processing Reconfiguration message due to improper validation | 7.5 |
| 2023-06-06 | CVE-2022-22076 | Unspecified vulnerability in Qualcomm products information disclosure due to cryptographic issue in Core during RPMB read request. | 5.5 |
| 2023-06-06 | CVE-2022-33251 | Reachable Assertion vulnerability in Qualcomm products Transient DOS due to reachable assertion in Modem because of invalid network configuration. | 7.5 |
| 2023-06-06 | CVE-2022-33264 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in modem due to stack based buffer overflow while parsing OTASP Key Generation Request Message. | 7.8 |
| 2023-06-06 | CVE-2022-40507 | Double Free vulnerability in Qualcomm products Memory corruption due to double free in Core while mapping HLOS address to the list. | 7.8 |